Intel Looking To Nanotubes As Thermal Interface Materials - New Technology

Mar 1 2004

Intel is investigating the feasibility of using carbon nanotubes as thermal interface materials.

They will use nanotubes from Zyvex where engineers have discovered how to suspend highly concentrated amounts of CNTs in solvents. This material can then be incorporated into polymers. The Intel team are looking at using such a CNT polymer composite as the thermal interface material between a microprocessor chip and the heat sink.

Posted 26th February 2004

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