Nanolithography News

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D2S Extends Partnership with NuFlare to Accelerate Deployment of eBeam Technologies

D2S®, a supplier of computational design platforms, today announced that it has extended its partnership with NuFlare Technology, a world leader in electron beam (eBeam) mask writing systems, to accelerate the deployment of eBeam technologies that reduce write times and improve the accuracy of advanced photomasks for future design nodes leveraging general purpose graphic processing unit (GPGPU) acceleration.

11 Sep 2013

eBeam Initiative Completes Second Annual Survey on Photomask Technology

The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced the completion of the second annual eBeam Initiative survey. 28 member companies from across the photomask supply chain participated in the survey.

11 Sep 2013

BioForce Nanosciences Enters Partnership with Acugenex

BioForce Nanosciences, Inc. (“BioForce”) announced the addition of Acugenex Limited (“Acugenex”) to BioForce’s international network of partners and distributors. The partnership will help BioForce increase its market share, support capabilities and manufacturing to Europe, the Middle East, Africa and parts of Asia.

From BioForce Nanosciences Inc. 11 Sep 2013

Bruker Introduces New LumiMap Electroluminescence System for HB-LED epi Wafer Process Metrology

At the 15th China International Optoelectronic Exposition (CIOE 2013), Bruker introduced the new LumiMap™ Electroluminescence System for uncompromised HB-LED epi wafer process metrology. LumiMap joins a suite of...

From Bruker Nano Surfaces and Metrology 5 Sep 2013

Better Nanostructures for Advanced Electronics through Breakthrough Nanofabrication Technique

An international group of researchers from the University of Minnesota, Argonne National Laboratory and Seoul National University have discovered a groundbreaking technique in manufacturing nanostructures that has the potential to make electrical and optical devices smaller and better than ever before. A surprising low-tech tool of Scotch Magic tape ended up being one of the keys to the discovery.

4 Sep 2013

Electron Beam Writer Critical for Development of Next-Generation Nanoscale Transistors

The new electron beam writer housed in the Nano3 cleanroom facility at the Qualcomm Institute is important for electrical engineering professor Shadi Dayeh’s two major areas of research. He is developing next-generation, nanoscale transistors for integrated electronics; and he is developing neural probes that have the capacity to extract electrical signals from individual brain cells and transmit the information to a prosthetic device or computer.

13 Aug 2013

Mini Mona Lisa Created Using AFM and ThermoChemical NanoLithography

The world’s most famous painting has now been created on the world’s smallest canvas. Researchers at the Georgia Institute of Technology have “painted” the Mona Lisa on a substrate surface approximately 30 microns in width – or one-third the width of a human hair.

6 Aug 2013

Authentication System Combining Moiré Patterns and Microlithography Techniques May Help Thwart Forgeries

In order to thwart forgeries, EPFL researchers propose a new miniaturized authentication system. By combining both, moiré patterns and microlithography techniques, it can be easily recognized by the naked eye and impossible to reproduce through currently existing printer or scanner technology.

31 Jul 2013

CEA-Leti Programs Extend 193nm Immersion Lithography for 1X Nodes

CEA-Leti said today that its multi-partner programs, IDEAL and IMAGINE, have demonstrated cost-effective solutions that extend 193nm immersion lithography for 1X nodes for critical levels such as contact and via, and for the cut layer, when multi-patterning is used.

From CEA-Leti 10 Jul 2013

USHIO to Deliver Interposer Stepper for 2.5D/3D Packaging Applications to Leading Manufacturer

USHIO INC. today announced that the company has booked the large-field stepper “UX7-3Di LIS 350” for manufacturing interposers used for 2.5D/3D packaging applications, and will deliver the first unit to a leading advanced-packaging manufacturer by the end of this month.

8 Jul 2013

Nanolithography News

D2S Extends Partnership with NuFlare to Accelerate Deployment of eBeam Technologies

eBeam Initiative Completes Second Annual Survey on Photomask Technology

BioForce Nanosciences Enters Partnership with Acugenex

Bruker Introduces New LumiMap Electroluminescence System for HB-LED epi Wafer Process Metrology

Better Nanostructures for Advanced Electronics through Breakthrough Nanofabrication Technique

Electron Beam Writer Critical for Development of Next-Generation Nanoscale Transistors

Mini Mona Lisa Created Using AFM and ThermoChemical NanoLithography

Authentication System Combining Moiré Patterns and Microlithography Techniques May Help Thwart Forgeries

CEA-Leti Programs Extend 193nm Immersion Lithography for 1X Nodes

USHIO to Deliver Interposer Stepper for 2.5D/3D Packaging Applications to Leading Manufacturer

Biochar-Modified Titanium Dioxide Nanocomposites for Enhanced Water Treatment

Boosting Hydrogen Fuel Production with TiO2 and Copper-Based MOFs

New Nanocage Material Removes Up to 90% of Toxic PFAS from Water

Enhancing Chitosan Films with Silanized Hexagonal Boron Nitride for Sustainable Applications

N-Doped Ti3O5: Enhanced Photocatalytic Removal of Phenolic Compounds from Wastewater

Overcoming Nanogold Production Challenges

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

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Utilizing Back-Gate Voltage Biases for 2D Materials

Resistivity Metrology for Sputtered ITO Thin Films

How Plasma Cleaning Technology Tackles Hydrocarbon Contamination

Optimizing EV Lubricants with Electrified Tribotesting