Nanofabrication News

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Cadence DFM Flows Adopted to Perform Electrical Variability Optimization for UMC 28nm Designs

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that after extensive benchmark testing, semiconductor foundry United Microelectronics Corporation (UMC) has adopted the Cadence® “in-design” and signoff design-for-manufacturing (DFM) flows to perform physical signoff and electrical variability optimization for 28nm designs.

From Cadence Design Systems 17 Jul 2013

DARPA Awards SwRI Three-Year Project to Develop Thin-Film Deposition Technologies

Work is under way at Southwest Research Institute on a $1.5 million, three-year project awarded by the Defense Advanced Research Projects Agency to develop novel technologies for depositing thin films.

16 Jul 2013

e2v Introduces P2041 and P3041 Quad-Core Processors

e2v, a leading global provider of hi-rel semiconductor solutions, has announced the availability of their P2041 and P3041 processors. These are extended-reliability versions of Freescale's quad core QorIQ™ processors for power-sensitive and computation intensive applications for demanding environments such as aerospace and defence.

15 Jul 2013

Inorganic Flexible Thin Film Solar Cell Successfully Fabricated Using Solution Processes

Scientists of Natcore Technology Inc., in collaboration with researchers at Rice University have successfully fabricated the first inorganic flexible thin film solar cell by solution processes. The work was reported in a recent issue of the journal Physical Chemistry Chemical Physics published by the Royal Society of Chemistry, volume 15, pages 3930-3938.

12 Jul 2013

Global 450 mm Consortium Selects Entegris Wafer Handling Products

Entegris, Inc. announced that its handling and shipping products for the safe, reliable transport and processing of 450 mm wafers were selected by the Global 450 mm Consortium (G450C), headquartered at SUNY’s College of Nanoscale Science and Engineering (CNSE) in Albany, New York, for use in the development of 450 mm wafer technology.

From Entegris 11 Jul 2013

Fairchild Semiconductor Adds Eight-Inch Wafer Fabrication Line in Korea

Fairchild Semiconductor, a leading global supplier of high performance power and mobile semiconductor solutions, officially opens an eight-inch wafer fabrication line in Bucheon, Korea. This new Fab symbolizes the company's focus on innovative power semiconductor solutions, as well as its investment in improving quality and responding to evolving market dynamics.

11 Jul 2013

CEA-Leti Programs Extend 193nm Immersion Lithography for 1X Nodes

CEA-Leti said today that its multi-partner programs, IDEAL and IMAGINE, have demonstrated cost-effective solutions that extend 193nm immersion lithography for 1X nodes for critical levels such as contact and via, and for the cut layer, when multi-patterning is used.

From CEA-Leti 10 Jul 2013

EV Group Unveils Fusion Wafer Bonding Platform for Manufacturing 3D-Integrated CMOS Image Sensors

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the latest version of its EVG®40NT automated measurement system, which is designed to work in concert with the company's GEMINI® FB fusion wafer bonding system to support the manufacture of next-generation 3D-integrated CMOS image sensors.

9 Jul 2013

Michigan Technological University Researchers Build Nano Battery with AC-STEM Microscope Using Tin Oxide

Lithium ion batteries are at the energetic heart of almost all things tech, from cell phones to tablets to electric vehicles. That’s because they are a proven technology, light, long-lasting and powerful. But they aren’t perfect.

9 Jul 2013

Rice University Researchers Create New Kind of Carbon Fibers Using Graphene Oxide

Large flakes of graphene oxide are the essential ingredient in a new recipe for robust carbon fiber created at Rice University.

9 Jul 2013

Nanofabrication News

Cadence DFM Flows Adopted to Perform Electrical Variability Optimization for UMC 28nm Designs

DARPA Awards SwRI Three-Year Project to Develop Thin-Film Deposition Technologies

e2v Introduces P2041 and P3041 Quad-Core Processors

Inorganic Flexible Thin Film Solar Cell Successfully Fabricated Using Solution Processes

Global 450 mm Consortium Selects Entegris Wafer Handling Products

Fairchild Semiconductor Adds Eight-Inch Wafer Fabrication Line in Korea

CEA-Leti Programs Extend 193nm Immersion Lithography for 1X Nodes

EV Group Unveils Fusion Wafer Bonding Platform for Manufacturing 3D-Integrated CMOS Image Sensors

Michigan Technological University Researchers Build Nano Battery with AC-STEM Microscope Using Tin Oxide

Rice University Researchers Create New Kind of Carbon Fibers Using Graphene Oxide

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Enhancing Material Properties through Nanotube Encapsulation

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

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