Nanofabrication News

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New Low-Cost, Desktop Nanofabrication Tool

A new low-cost, high-resolution tool is primed to revolutionize how nanotechnology is produced from the desktop, according to a new study by Northwestern University researchers.

20 Jul 2013

NANOBYK -3630 - Nanoadditive by BYK-Chemie used for Solvent-borne and High-solid Architectural Coatings

Coatings formulated using alkyd resins have been well established in the market for decades. The main application fields for these systems are architectural coatings. Modern challenges and regulations have required tr...

From BYK-Chemie GmbH 19 Jul 2013

H2W Tech Release New High Stability Stepper Driver

The SD-03-48-125 from H2W Technologies is a cost effective, high performance, bi-polar, two phase micro-stepping drive which utilizes the pure-sinusoidal current control technique. It is best suited for applications which require extreme low noise and heat. It operates well in an environment where input voltage may experience instability and fluctuation.

From H2W Technologies 18 Jul 2013

XEI Scientific Announce China Distribution Deal with Yi Xin Technology

XEI Scientific Inc, maker of the popular EVACTRON® De-Contaminator™ Plasma Cleaning System for electron microscopes and other vacuum chambers, has appointed the Yi Xin Technology Group to be the exclusive distr...

From XEI Scientific 17 Jul 2013

Cadence DFM Flows Adopted to Perform Electrical Variability Optimization for UMC 28nm Designs

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that after extensive benchmark testing, semiconductor foundry United Microelectronics Corporation (UMC) has adopted the Cadence® “in-design” and signoff design-for-manufacturing (DFM) flows to perform physical signoff and electrical variability optimization for 28nm designs.

From Cadence Design Systems 17 Jul 2013

DARPA Awards SwRI Three-Year Project to Develop Thin-Film Deposition Technologies

Work is under way at Southwest Research Institute on a $1.5 million, three-year project awarded by the Defense Advanced Research Projects Agency to develop novel technologies for depositing thin films.

16 Jul 2013

e2v Introduces P2041 and P3041 Quad-Core Processors

e2v, a leading global provider of hi-rel semiconductor solutions, has announced the availability of their P2041 and P3041 processors. These are extended-reliability versions of Freescale's quad core QorIQ™ processors for power-sensitive and computation intensive applications for demanding environments such as aerospace and defence.

15 Jul 2013

Inorganic Flexible Thin Film Solar Cell Successfully Fabricated Using Solution Processes

Scientists of Natcore Technology Inc., in collaboration with researchers at Rice University have successfully fabricated the first inorganic flexible thin film solar cell by solution processes. The work was reported in a recent issue of the journal Physical Chemistry Chemical Physics published by the Royal Society of Chemistry, volume 15, pages 3930-3938.

12 Jul 2013

Global 450 mm Consortium Selects Entegris Wafer Handling Products

Entegris, Inc. announced that its handling and shipping products for the safe, reliable transport and processing of 450 mm wafers were selected by the Global 450 mm Consortium (G450C), headquartered at SUNY’s College of Nanoscale Science and Engineering (CNSE) in Albany, New York, for use in the development of 450 mm wafer technology.

From Entegris 11 Jul 2013

Fairchild Semiconductor Adds Eight-Inch Wafer Fabrication Line in Korea

Fairchild Semiconductor, a leading global supplier of high performance power and mobile semiconductor solutions, officially opens an eight-inch wafer fabrication line in Bucheon, Korea. This new Fab symbolizes the company's focus on innovative power semiconductor solutions, as well as its investment in improving quality and responding to evolving market dynamics.

11 Jul 2013