Nanofabrication News

RSS

Breakthrough Technique Enables 3D Optical Beam Lithography at Nine Nanometers

A research team at Swinburne University of Technology has overcome a fundamental law of optical science that could lead to faster and more energy-efficient optical computing.

20 Jun 2013

CEA-Leti to Host Workshop on Future Technology Developments at SEMICON West 2013

CEA-Leti will host a workshop at SEMICON West 2013 on major technology developments in the next 10 years.

From CEA-Leti 20 Jun 2013

Researchers Demonstrate the Ability to 3D-Print Microbatteries

3D printing can now be used to print lithium-ion microbatteries the size of a grain of sand. The printed microbatteries could supply electricity to tiny devices in fields from medicine to communications, including many that have lingered on lab benches for lack of a battery small enough to fit the device, yet provide enough stored energy to power them.

19 Jun 2013

GLOBALFOUNDRIES’ 28nm HKMG Technology Helps Rockchip Ramp up Production of Mobile Processors

GLOBALFOUNDRIES and Fuzhou Rockchip Electronics Co., Ltd. today announced that Rockchip’s next-generation mobile processors are ramping to production on GLOBALFOUNDRIES’ 28nm High-K Metal Gate (HKMG) process technology.

From GlobalFoundries 18 Jun 2013

X-FAB Enhances XP018 Process to Lower Chip Costs for Smart Analog Ics

X-FAB Silicon Foundries today announced it has enhanced the XP018 process with multiple options to lower chip costs for high-performance analog applications such as audio, sensor interface and 5V-environment power management applications. These options make the XP018 ideal for cost-sensitive consumer applications that require analog integration in 180nm technologies.

18 Jun 2013

Complex ASIC Developed for A350 XWB Flight Control Computer

ON Semiconductor, driving innovation in energy efficiency, and Airbus, a leading aircraft manufacturer, have collaboratively developed and released to production a complex Application Specific Integrated Circuit (ASIC) for the A350 XWB Flight Control Computer.

18 Jun 2013

China’s GSMC Selects SPTS Rapier Etch System to Manufacture Inertial MEMS Devices

SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that it has secured an order from one of China’s leading foundries, Grace Semiconductor Manufacturing Corporation (GSMC). The SPTS Omega c2L Rapier etch system will be used to manufacture inertial MEMS devices in Shanghai, China.

12 Jun 2013

eMemory's Embedded Non-Volatile Memory Technologies to be Integrated into UMC's 28nm Process

eMemory, an embedded non-volatile memory (eNVM) industry leader and United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced an expanded technology cooperation to integrate eMemory's one-time-programmable (OTP) and multiple-time-programmable (MTP) embedded non-volatile memory technologies into UMC's 28nm process.

12 Jun 2013

Researchers Develop Improved Technique for Producing Nanocrystals

Using star-shaped block co-polymer structures as tiny reaction vessels, researchers have developed an improved technique for producing nanocrystals with consistent sizes, compositions and architectures – including metallic, ferroelectric, magnetic, semiconductor and luminescent nanocrystals.

From Georgia Institute of Technology 12 Jun 2013

Novel Approach to Grow III-V semiconductor Nanowires without Metal Catalysts or Nano-Patterning

The research team demonstrated a novel method to epitaxially synthesize structurally and compositionally homogeneous and spatially uniform ternary InAsyP1-y nanowire on Si at wafer-scale using metal-organic chemical vapor deposition (MOCVD).

11 Jun 2013