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New Patent by Contipro - Jet for Coaxial Nanofibers Production

Although nanofibres are thousands of times finer than a human hair, with current technology scientists can produce fibres of this size where the inside is made with a different material from the outer coating.

From Contipro 31 May 2013

SMIC Holds Advanced Technology Workshop on 40nm and 28nm Design Solutions in Shanghai

Semiconductor Manufacturing International Corporation ("SMIC";), mainland China's largest and most advanced semiconductor foundry, held its 2013, also the 5th, advanced technology workshop in Shanghai today.

From Semiconductor Manufacturing International Corporation (SMIC) 31 May 2013

Quantum Dots within Thermoelectric Material Increase Heat-to-Energy Conversion

High-performance thermoelectric materials that convert waste heat to electricity could one day be a source of more sustainable power. But they need to be a lot more efficient before they could be effective on a broad scale in places like power plants or military bases, researchers say.

31 May 2013

Novel Material Utilizes Nanometer-Scale Structures to Make Paper Repellent to Liquids

Paper is known for its ability to absorb liquids, making it ideal for products such as paper towels. But by modifying the underlying network of cellulose fibers, etching off surface “fluff” and applying a thin chemical coating, researchers have created a new type of paper that repels a wide variety of liquids – including water and oil.

30 May 2013

Mentor’s Calibre nmPlatform for 16nm FinFET Receives TSMC Certification

Mentor Graphics Corp. today announced that its Calibre® physical verification platform has achieved version 0.1 of design reference manual (DRM) and SPICE model tool certification for TSMC’s 16nm manufacturing process, which incorporates 3D (FinFET) transistors for higher performance.

30 May 2013

Major Foundry Acquires Axcelis Purion M Medium Current Implanter for Sub 2Xnm Node Logic Devices

Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced today that it has shipped the Company's new Purion M™ medium current implanter to one of the world's leading foundries.

30 May 2013

QMF and SPTS Achieve Epitaxial Growth of 3C SiC Films on 300mm Silicon Wafers

The Queensland Micro and Nanotechnology Facility (QMF) of Griffith University and industry partner SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, have announced epitaxial growth of 3C silicon carbide (SiC) films on 300mm silicon wafers.

30 May 2013

Mentor Graphics Partners with TSMC to Advance 20nm Physical Verification Kit

Mentor Graphics Corp. today announced significant achievements in its continued collaboration with TSMC on 20nm physical verification kit optimizations. This joint effort has reduced Calibre® nmDRC™ 20nm signoff runtimes by at least a factor of 3X and memory requirements by 60% compared to initial design kits released last year.

30 May 2013

Semiconductor Packaging and Test Services Provider, STATS ChipPAC, Opens New Building in Singapore

STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" ), a leading provider of advanced semiconductor packaging and test services, today celebrated the grand opening of its new building in Singapore with more than 150 distinguished guests, including Singapore Deputy Prime Minister and Coordinating Minister for National Security & Minister for Home Affairs, Mr. Teo Chee Hean, and other governmental and business representatives.

30 May 2013

TSMCfs 16-nm FinFET Process Used to Create High Performance FPGAs

Xilinx Inc. and TSMC announced that they are teaming together to create the fastest time-to-market and highest performance FPGAs to be built on TSMCfs 16-nanometer FinFET i16FinFETj process, a program Xilinx calls eFinFast.f

From TSMC Taiwan Semiconductor Manufacturing Company 29 May 2013

Nanofabrication News

New Patent by Contipro - Jet for Coaxial Nanofibers Production

SMIC Holds Advanced Technology Workshop on 40nm and 28nm Design Solutions in Shanghai

Quantum Dots within Thermoelectric Material Increase Heat-to-Energy Conversion

Novel Material Utilizes Nanometer-Scale Structures to Make Paper Repellent to Liquids

Mentor’s Calibre nmPlatform for 16nm FinFET Receives TSMC Certification

Major Foundry Acquires Axcelis Purion M Medium Current Implanter for Sub 2Xnm Node Logic Devices

QMF and SPTS Achieve Epitaxial Growth of 3C SiC Films on 300mm Silicon Wafers

Mentor Graphics Partners with TSMC to Advance 20nm Physical Verification Kit

Semiconductor Packaging and Test Services Provider, STATS ChipPAC, Opens New Building in Singapore

TSMCfs 16-nm FinFET Process Used to Create High Performance FPGAs

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Enhancing Material Properties through Nanotube Encapsulation

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

Sponsored Content

Characterization of Active Pharmaceutical Ingredients, Injectables, and Proteins

The Future of Wound Care: Why Nanofibers are Key to Accelerated Healing

The Evolution of Lipid Nanoparticles

How Emulsion Electrospinning is Transforming Materials