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Cymer Announce Development Milestone for EUV Lithography

A significant milestone in extreme ultraviolet (EUV) lithography was reported by Cymer's David Brandt last week at SPIE Advanced Lithography 2013 in San Jose. The event, which drew more than 2200 attendees, ran Feb. 24-28.

From Cymer, Inc. 8 Mar 2013

Integran Receives Patents for Nanovate Structural Metal Plating-On-Polymer Technology

Toronto-based Integran Technologies Inc. (Integran) today announced further advances in its "structural metal plating-on-polymer" technology (Nanovate™ NP) for enhancing fuel efficiency and reducing greenhouse gas emissions by enabling the cost-effective manufacture of lightweight transportation parts.

From Integran Technologies Inc. 7 Mar 2013

ESI Releases UV Laser Drilling System for the Microtechnology Industry

Electro Scientific Industries, Inc., a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced the release of its Model 5335 UV Laser Drilling System.

From Electro Scientific Industries (ESI) 6 Mar 2013

WXIC to Optimize 65-nm, 300MM Wafer Production for GigaDevice's NOR Flash Products

WXIC (Wuhan Xinxin Semiconductor Manufacturing), a leading 12-inch semiconductor manufacturing company in China, today announced a long-term supply agreement with GigaDevice Semiconductor Inc., a specialist in NOR Flash memory products.

6 Mar 2013

Gold Nanogap Structure Helps Detect Ionic Mercury with High Sensitivity

A research group of WPI-MANA, including Dr. Chung Vu Hoang (Doctoral Research Fellow), Dr. Tadaaki Nagao (Group Leader of Nano-System Photonics Group), Dr. Masakazu Aono (Director-General of MANA), and others discovered that it is possible to detect diluted ionic mercury in water with more than 10 times higher sensitivity than with the conventional spectroscopy method.

5 Mar 2013

UMC's 40nm Logic Process Integrated with Spansion eCT Flash Memory Technology

Spansion Inc., a leading innovator of Flash memory solutions, and United Microelectronics Corporation ("UMC"), today announced the joint development of a 40nm process that integrates UMC's 40nm LP logic process with Spansion® proprietary embedded Charge Trap (eCT)TM Flash memory technology. As part of this non-exclusive agreement, UMC is licensed to manufacture products based on this technology for Spansion.

From Infineon Technologies AG 5 Mar 2013

Primoceler Reports First Sale of New Laser-Based Welding Machine for MEMS

Microfabrication company Primoceler Inc. (http://www.primoceler.com) has finalized the first sale of its new laser-based welding machine for microelectromechanical systems (MEMS). A company based in Europe purchased the machine, which produces an extremely small heat-affected zone (HAZ) during the hermetic sealing of sensitive or organic components, eliminating the risk of damaging those components.

5 Mar 2013

$Jordan Valley's High-Resolution X-Ray Diffractometer Wins CS Industry Award$

Jordan Valley's High-Resolution X-Ray Diffractometer Wins CS Industry Award

Jordan Valley Semiconductor, a market leader of X-Ray metrology tools, announced today that its QC3™, a production worthy diffractometer for the compound semiconductor and LED industries, is the winner of CS Industry 2013 metrology, test and measurement award.

5 Mar 2013

H2W Technologies Introduces High Acceleration Voice Coil Driven Closed Loop Positioning System

H2W Technologies introduces a high acceleration, voice coil driven, XYpositioning stage with a precision bearing system,which minimizes the amount of pitch, yaw, and roll in the system.

From H2W Technologies 4 Mar 2013

Call for Papers for NanoEx 2013 is Now Open

BHR Group, internationally recognised global consultants in innovative fluid engineering and technology conference specialists, proudly announces this year´s nanomaterials conference, International Conference on Industrial Processes for Nanomaterials, NanoEx 2013.

1 Mar 2013