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New Report on Global and Chinese Wafer Foundry Industry

Research and Markets has announced the addition of the "Research on Global and Chinese Wafer Foundry Industry, 2012" report to their offering.

From Research and Markets 13 Feb 2013

Nanoscale Method Enables Thin Ferroelectric Films with Exceptional Electric Properties

Like turning coal to diamond, adding pressure to an electrical material enhances its properties. Now, University of Illinois at Urbana-Champaign researchers have devised a method of making ferroelectric thin films with twice the strain, resulting in exceptional performance.

From University of Illinois at Urbana-Champaign 12 Feb 2013

Nanoscribe Showcases 3D Printer of Micro- and Nanostructures at Photonics West

At the Photonics West, the leading international fair for photonics taking place in San Francisco (USA) this week, Nanoscribe GmbH, a spin-off of Karlsruhe Institute of Technology (KIT), presents the world's fastest 3D printer of micro- and nanostructures.

11 Feb 2013

Synopsys’ 28-nm Lithography Hot-Spot Checking Technology Adopted by UMC

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that United Microelectronics Corporation (UMC) has selected Synopsys' IC Validator physical verification product for lithography hot-spot checking at the 28-nm process node.

From Synopsys, Inc. 8 Feb 2013

Novel Nanostructure Filters Visible Light into Plasmonic Halos

Using the geometric and material properties of a unique nanostructure, Boston College researchers have uncovered a novel photonic effect where surface plasmons interact with light to form "plasmonic halos" of selectable output color. The findings appear in the journal Nano Letters.

8 Feb 2013

Dalian Institute of Chemical Physics Purchases Heidelberg Table Top Maskless Aligner System

Heidelberg Instruments announced the sale of a µPG 501 table top maskless aligner system to the Dalian Institute of Chemical Physics, Dalian, China.

7 Feb 2013

ProPlus Leverages DFY Knowledge to Meet Challenges of 45-nm Technology

ProPlus Design Solutions, Inc., the global leader for SPICE modeling solutions and the leading technology provider for design for yield (DFY) applications, expanded its business in 2012 to offer a fully integrated DFY product portfolio.

7 Feb 2013

GLOBALFOUNDRIES Certifies Cadence Technologies for 20-nm LPM Production Node

Cadence Design Systems, Inc., a leader in global electronic design innovation, announced today that GLOBALFOUNDRIES has certified essential Cadence® technologies for custom/analog, digital and mixed-signal design, implementation, and verification for its 20-nanometer LPM technology. The certification covers the Virtuoso and Encounter platforms, including the industry-standard SKILL process design kit (PDK).

7 Feb 2013

Veeco to Supply NEXUS Ion Beam Etch System to EPFL

Veeco Instruments Inc. announced today that École Polytechnique Fédérale de Lausanne (EPFL), one of Europe’s top technical universities, has ordered a NEXUS® Ion Beam Etch (IBE) System. The system will be used for state-of-the-art research and development projects in micro- and nano-fabrication at its Lausanne, Switzerland site.

From Veeco 6 Feb 2013

Light Funneling Using Nanoscale Metallic Grooves

Iridescence, or sheen that shifts color depending on your viewing angle, is pretty in peacock feathers. But it's been a nuisance for engineers trying to mimic the birds' unique color mechanism to make high-resolution, reflective, color display screens.

6 Feb 2013