The Semiconductor Manufacturing International Corporation (SMIC), headquartered in Shanghai, China, have purchased multiple systems for photomask verification, repair and metrology from Carl Zeiss Semiconductor Metrology Systems (SMS) Division (www.zeiss.com/sms), a leading supplier of both photomask metrology and manufacturing equipment. SMIC will apply the tools as economic solutions for their mask services.
Faraday Technology Corporation, a leading ASIC and silicon IP provider, and United Microelectronics Corporation, a leading global semiconductor foundry, today announced that they have produced customer system-on-chip (SoC) ICs with a density of over 300 million gates.
Veeco Instruments Inc. announced today that the University of Waterloo, located at the heart of Canada’s technology hub, has purchased a GEN10® Molecular Beam Epitaxy system for its recently opened Quantum-Nano Centre (QNC) hosting the Waterloo Institute for Nanotechnology (WIN) and the Institute for Quantum Computing (IQC). The system will be installed in the new MBE laboratory being established by Professor Zbig Wasilewski, Endowed Nanotechnology Chair at WIN.
Three University of California, Riverside scientists and engineers are members of a new national research center — the Center for Spintronic Materials, Interfaces, and Novel Architectures (C-SPIN) — focused on developing the next generation of microelectronics. Led by the University of Minnesota, C-SPIN is being supported by a five-year $28 million grant, about $3 million of which is allocated to UC Riverside.
In developing these novel self-assembling materials, postdoc Barbara Capone has focused on the design of organic and inorganic building blocks, which are robust and can be produced at large scale. Capone has put forward, together with her colleagues at the Universities of Vienna and Mainz, a completely new pathway for the construction of building blocks at the nanoscale.
SPTS Technologies, a leading supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced the receipt of a multi-system order from DigitalOptics Corporation (DOC), a wholly-owned subsidiary of Tessera, for Pegasus Rapier deep silicon etch and Primaxx HF Vapor release systems. These systems will be used to manufacture MEMS-based autofocus actuators for smart phone cameras.
A nanoscale coating that's at least 95 percent air repels the broadest range of liquids of any material in its class, causing them to bounce off the treated surface, according to the University of Michigan engineering researchers who developed it.
United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today introduced a Thick Plated Copper (TPC) process for power management IC (PMIC) applications.
Using graphene – either as an alternative to, or most likely as a complementary material with – silicon, offers the promise of much faster future electronics, along with several other advantages over the commonly used semiconductor. However, creating the one-atom thick sheets of carbon known as graphene in a way that could be easily integrated into mass production methods has proven difficult.
There’s hardly a moment in modern life that doesn’t involve electronic devices, whether they’re guiding you to a destination by GPS or deciding which incoming messages merit a beep, ring or vibration. But our expectation that the next shopping season will inevitably offer an upgrade to more-powerful gadgets largely depends on size – namely, the ability of the industry to shrink transistors so that more can fit on ever-tinier chip surfaces.
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