Nanofabrication News

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Intersil to Donate its Semiconductor Wafer Fabrication Facility

Intersil Corporation, a world leader in the design and manufacture of high-performance analog and mixed-signal semiconductors, today announced that it will donate a high-technology semiconductor wafer fabrication facility and the land it occupies to the University of Central Florida.

22 Apr 2010

SEMATECH Experts Outlines New Developments in Wafer Bonding, Copper Removal and Wafer Thinning

With a focus on providing cost-effective and reliable solutions to speed manufacturing readiness of 3D technology options, experts from SEMATECH's 3D Interconnect Program based at the College of Nanoscale Science and...

21 Apr 2010

Industrial Nanotech Becomes Member of DOE’s Save Energy Now ALLY Program

Industrial Nanotech, Inc., an emerging global leader in nanoscience energy saving solutions, today announced that the Company has been approved as a member of the U.S. Department of Energy’s (DOE’s) Industrial Technologies Program Save Energy Now as an ALLY organization.

From Industrial Nanotech, Inc. 21 Apr 2010

veonis Chosen as Agent for Tegal's DRIE Products in Germany

Tegal Corporation, an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices, announced today it has appointed veonis Technologies GmbH, Puchheim, Germany, as its agent for silicon DRIE and dielectric DRIE products in Germany.

From Collabrx, Inc. 21 Apr 2010

First Findings and Collaboration on Chemical Mechanical Polishing for Novel Materials

Researchers at imec and at the Center for Advanced Materials Processing (CAMP) of the Clarkson University in Potsdam, New York (U.S.) have recently started a collaboration to study the fundamentals of CMP processes for novel materials such as Ge or III/V compounds.

From IMEC 20 Apr 2010

Imec Develop Stable Patterned Electrets With Feature Sizes at Least Down to 20 Microns

Imec and Holst Centre have developed stable patterned electrets with feature sizes at least down to 20µm. The technology consists in creating a charged profile in a SiO2/Si3N4 structure by exploiting the difference in energy between the charge traps located in either layer and at their interface.

From IMEC 20 Apr 2010

Hydrogen and Inert Species Improve Solid Phase Epitaxy of Ge on Si

Imec has shown that the presence of hydrogen and/or inert species during Ge deposition significantly improves the quality of the Ge layers grown on Si by solid phase epitaxy (SPE). The resulting layers have excellent crystalline quality and low surface roughness, making SPE a valuable alternative for conventional heteroepitaxy which is performed typically at much higher temperatures.

From IMEC 20 Apr 2010

Nanofabrication News

Intersil to Donate its Semiconductor Wafer Fabrication Facility

SEMATECH Experts Outlines New Developments in Wafer Bonding, Copper Removal and Wafer Thinning

Industrial Nanotech Becomes Member of DOE’s Save Energy Now ALLY Program

veonis Chosen as Agent for Tegal's DRIE Products in Germany

First Findings and Collaboration on Chemical Mechanical Polishing for Novel Materials

Imec Develop Stable Patterned Electrets With Feature Sizes at Least Down to 20 Microns

Hydrogen and Inert Species Improve Solid Phase Epitaxy of Ge on Si

Lam Research Announces Shipment of 3,000th Single-Wafer SEZ Spin Clean Module

AIXTRON receives Order for Black Magic CNT Deposition System from Delft University of Technology

New Technologies Produce Die Castings with Finer Microstructure and Low Porosity

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Enhancing Material Properties through Nanotube Encapsulation

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

Sponsored Content

Characterization of Active Pharmaceutical Ingredients, Injectables, and Proteins

The Future of Wound Care: Why Nanofibers are Key to Accelerated Healing

The Evolution of Lipid Nanoparticles

How Emulsion Electrospinning is Transforming Materials