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Quick, Accurate and Economical Way to Detect and Correct Pressure Variations in Wafer Bonding Process

Quick, Accurate and Economical Way to Detect and Correct Pressure Variations in Wafer Bonding Process

Fast and Affordable Genome Sequencing Moved a Step Closer with New Solid-State Nanopore Sensor

Amtech Systems Comments on Significance of Research Collaboration Agreement

AIXTRON Receives Order for MOCVD System from CAS

Agar Announces Availability of Latest Kleindiek Nanotechnik's in-Situ Lift-Out System Brochure

Agar Announces Availability of Latest Kleindiek Nanotechnik's in-Situ Lift-Out System Brochure

Nanotech 2009 Drew a Record Crowd

Changing the Way Nanodevices are Designed and Fabricated

Changing the Way Nanodevices are Designed and Fabricated

Micralyne Project Engineer to Speak at IITC 2009

Defining New Standard in Metal Deposition Productivity and Reliability for Chip Packaging

Defining New Standard in Metal Deposition Productivity and Reliability for Chip Packaging

The Only Copper Barrier/Seed Deposition Technology Qualified for 32 and 22nm Production

The Only Copper Barrier/Seed Deposition Technology Qualified for 32 and 22nm Production

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