Nanofabrication News

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Innovative Copper Electrochemical Process Eliminates Defects when Scaling to 32nm Technology Node

Since the advent of copper damascene processing, achieving void-free fill of high aspect ratio interconnect features has been a key challenge for device manufacturers. Shrinking dimensions at each successive technology node have increased the complexity of the copper seed and electroplating processes, and stringent yield and reliability requirements have intensified the focus on reducing defects.

9 Apr 2009

Book Examines Principles of Nanophotonics and Novel Nanofabrication Technologies

Research and Markets has announced the addition of John Wiley and Sons Ltd's new report "Nanophotonics and Nanofabrication" to their offering. Starting out with a review of the principles of nanophotoni...

From Research and Markets 9 Apr 2009

New Technique Making it Possible to Create Nano Features Without Using UV Light

The ability to create tiny patterns is essential to the fabrication of computer chips and many other current and potential applications of nanotechnology.

9 Apr 2009

iTi Solar Named IDTechEx Printed Electronics Europe Award 2009 Finalist

iTi Solar, a manufacturer dedicated to advancing the economics of clean, renewable energy through the use of industrial inkjet technologies, today announced that its Solar Materials Deposition System (MDS) was named as a...

8 Apr 2009

IDTechEX Honors Fully Printed 5 GHz Transistor as The Year's Most Significant R+D Achievement in Printed Electronics Industry

Optomec announced today that the company, along with their partners, the University of Massachusetts-Lowell and Brewer Science, has won the IDTechEx Academic R+D Award for Printed Electronics. The award, which will be...

From Optomec 8 Apr 2009

First Nano Announces Participation in Two Industry Conferences and Trade Shows

First Nano, a division of CVD Equipment Corporation (NASDAQ: CVV), announced today that it will exhibit at the 7th Annual Nano Technology for Defense Conference, 6 - 9 April 2009 in Burlingame, CA and the Materials Resea...

From CVD Equipment Corporation 7 Apr 2009

AIXTRON Receives Order for CCS MOCVD System from Dalian University of Technology

AIXTRON AG today announced that Dalian R&D Center of Optoelectronic Technology at Dalian University of Technology (DUT), based in Dalian City in P.R. China, has ordered one Close-Coupled Showerhead (CCS) MOCVD system.

From AIXTRON SE 7 Apr 2009

Tower Semiconductor to Support Applied Materials Wafer Processing Systems

Tower Semiconductor Ltd. and Applied Materials, Inc. announced today that they have signed a five-year contract to support all Applied Materials wafer processing systems at Tower's Fab 2 manufacturing facility in Migdal Haemek, Israel.

From Applied Materials Inc. 6 Apr 2009

CEA/Leti and EV Group to Accelerate Adoption of TSV and 3D Integration Technology

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has entered a joint development program (JDP) with CEA/Leti -- one ...

From CEA-Leti 1 Apr 2009

European Patent Office Revoke Solar Photovoltaic Patent Issued to University of Neuchatel

In an oral decision issued today, the European Patent Office (EPO) revoked European Patent No. EP 0 871 979 issued to the University of Neuchatel (the Neuchatel patent), which pertains to solar photovoltaic (PV) technology.

From Applied Materials Inc. 31 Mar 2009

Nanofabrication News

Innovative Copper Electrochemical Process Eliminates Defects when Scaling to 32nm Technology Node

Book Examines Principles of Nanophotonics and Novel Nanofabrication Technologies

New Technique Making it Possible to Create Nano Features Without Using UV Light

iTi Solar Named IDTechEx Printed Electronics Europe Award 2009 Finalist

IDTechEX Honors Fully Printed 5 GHz Transistor as The Year's Most Significant R+D Achievement in Printed Electronics Industry

First Nano Announces Participation in Two Industry Conferences and Trade Shows

AIXTRON Receives Order for CCS MOCVD System from Dalian University of Technology

Tower Semiconductor to Support Applied Materials Wafer Processing Systems

CEA/Leti and EV Group to Accelerate Adoption of TSV and 3D Integration Technology

European Patent Office Revoke Solar Photovoltaic Patent Issued to University of Neuchatel

Biochar-Modified Titanium Dioxide Nanocomposites for Enhanced Water Treatment

New Nanocage Material Removes Up to 90% of Toxic PFAS from Water

Enhancing Chitosan Films with Silanized Hexagonal Boron Nitride for Sustainable Applications

Gold Nanoparticles to Restore Vision in Retinal Disorders

Light-Induced Symmetry Shifts Enable New Advances in Nanomaterials

Overcoming Nanogold Production Challenges

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

Sponsored Content

Utilizing Back-Gate Voltage Biases for 2D Materials

Resistivity Metrology for Sputtered ITO Thin Films

How Plasma Cleaning Technology Tackles Hydrocarbon Contamination

Optimizing EV Lubricants with Electrified Tribotesting