Nanofabrication News

RSS

eHARP system Extending Proven Gap-Fill Technology for Critical STI Device Structures to 32nm and Beyond

The eHARP process delivers void-free films to fill <30nm, >12:1 aspect ratio features - essential requirements for the fabrication of advanced memory and logic devices. Featuring proprietary new process innovations, the eHARP system's robust, high-density, strain-inducing films enable the scaling of conventional planar and emerging 3-D device structures.

15 Jul 2008

Depositing Critical Barrier Films for Copper Interconnects in Sub-55nm Memory Chips

Applied Materials, Inc. today announced its Applied Endura® Extensa(TM) PVD1, the industry's only production-worthy system for depositing the critical barrier films for copper interconnects in sub-55nm memory chips.

15 Jul 2008

New Tools and Processes Designed to Enable Next-Generation MEMS Development

To meet the need for advanced micro-electromechanical systems (MEMS) tools, SVTC Technologies, a leading independent semiconductor process-development foundry, announced that it has expanded its capabilities to enable cu...

15 Jul 2008

IQ Aligner Selected for its UV Nanoimprint Lithography Capability

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Heptagon Micro-Optics Pte Ltd. in Singapore -- a wholly-owned sub...

15 Jul 2008

Oxford Instruments Plasma Technology Launches Latest Customer Support Package

Oxford Instruments Plasma Technology (OIPT), part of Oxford Instruments plc, is pleased to announce the recent launch of its latest customer support package, the 'Pre-Purchased Service Fund' scheme.

15 Jul 2008

32nm SRAM Fabricated Using EUV Technology

IMEC reports functional 0.186µm2 32nm SRAM cells made with FinFETs from which the contact layer was successfully printed using ASML's full field extreme ultraviolet (EUV) Alpha Demo Tool (ADT). Applied Materials, using its most advanced deposition systems, was key to fabricating the ultra-small circuit structures.

15 Jul 2008

Aviza Technology Receives Order from Advanced Logic IC Manufacturer in Japan

Aviza Technology, Inc., a supplier of advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets, today announced that it has received an order for its Cel...

11 Jul 2008

Building Components of Electronics Devices using Self-Organised NanoStructures

Confocal microscope image of a self-assembled monolayer of a polychlorotriphenyl methyl radical patterned on a quartz surface. This multifunctional molecule behaves as an electroactive switch with optical and magnetic re...

10 Jul 2008

Controlling How Many and What Type of Atoms in a Nanocluster

Researchers from the U.S. Department of Energy's (DOE) Brookhaven National Laboratory and Stony Brook University have developed a new instrument that allows them to control the size of nanoclusters - groups of 10 to 100 atoms - with atomic precision. They created a model nanocatalyst of molybdenum sulfide, the first step in developing the next generation of materials to be used in hydrodesulfurization, a process that removes sulfur from natural gas and petroleum products to reduce pollution.

10 Jul 2008