Nanofabrication News

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Bristol Awarded £450,000 to Develop GaN Nano-Engineered Semiconductors

The Universities of Bath, Bristol, Sheffield and Strathclyde and their industrial partners have been given funding to develop the UK into a future hub for the manufacture of advanced semiconductor materials.

23 Dec 2014

Nanothin Semiconductor Layer Provides Ultrathin Coatings in Vivid Colors

In a sub-basement deep below the Laboratory for Integrated Science and Engineering at Harvard University, Mikhail Kats gets dressed. Mesh shoe covers, a face mask, a hair net, a pale gray jumpsuit, knee-high fabric boots, vinyl gloves, safety goggles, and a hood with clasps at the collar--these are not to protect him, Kats explains, but to protect the delicate equipment and materials inside the cleanroom.

23 Dec 2014

Samsung Commences Mass Production of 20nm 8Gb LPDDR4 Mobile DRAM

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has started mass producing the industry’s first 8 gigabit (Gb), low power double data rate 4 (LPDDR4) mobile DRAM based on the company’s leading-edge 20-nanometer (nm) process technology. LPDDR memories are the most widely used “working memory” for mobile devices worldwide.

From Samsung Electronics 23 Dec 2014

Renesas Electronics Develops New Circuit Technology for Automotive Information SoCs at 16nm

Renesas Electronics Corporation, a premier provider of advanced semiconductor solutions, today announced the development of a new circuit technology for automotive information SoCs (system on chips) at 16 nanometer (nm) and beyond.

19 Dec 2014

Quad-Core Silicon Built Around ARM Cortex-A17 Processor Implemented Using GLOBALFOUNDRIES’ 28nm-SLP Process Delivered

Cadence Design Systems, Inc., a leader in global electronic design innovation, and GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced the delivery of quad-core silicon built around the ARM® Cortex®-A17 processor implemented using GLOBALFOUNDRIES’ 28nm Super Low Power (28nm-SLP) process with High-k Metal Gate (HKMG) technology.

From Cadence Design Systems 19 Dec 2014

Atomic Force Microscopy Etches Nanoscale Patterns on Conductive Polymers

Researchers at Oak Ridge National Laboratory (ORNL) have successfully carved out nanoscale designs on polymer surfaces using atomic force microscopy (AFM).

From Oak Ridge National Laboratory 18 Dec 2014

Synopsys Expands Collaboration with Nanoelectronics Research Center imec

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the expansion of its collaboration with nanoelectronics research center imec to nanowire and other devices (FinFETs, Tunnel-FETs) targeting the 5-nanometer (nm) technology node and beyond.

18 Dec 2014

Oxford Instruments Report Successful Nanotechnology Seminars in Delhi, Kolkata

Oxford Instruments and IIT Delhi were honoured by the attendance and enlightening inaugural talk that was given by Dr. Chidambaram, Principal Scientific Advisor to the Government of India at the start of the Oxford Instruments two day technical seminar held at IIT Delhi at the end of November.

From Oxford Instruments Plasma Technology 18 Dec 2014

SMIC Commences Operations at Shenzhen 200mm Wafer Fab

Semiconductor Manufacturing International Corporation, the largest and most advanced pure-play foundry provider in China, announced today it has begun operations at its Shenzhen 200mm wafer fab. This fab is the first 8-inch production line to be put into operation in Southern China, and is also the first domestic IC production line to be launched after the 'National Outline of Promoting the Development of IC Industry' was issued this year.

18 Dec 2014

Amkor Grants GLOBALFOUNDRIES Non-Exclusive License to Copper Pillar Wafer Bump Technology

Amkor Technology, Inc., a leading provider of semiconductor assembly and test services, today announced that it has granted GLOBALFOUNDRIES a non-exclusive license to its proprietary copper pillar wafer bump technology.

From GlobalFoundries 17 Dec 2014