Nanofabrication News

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XENON to Demonstrate S-2300 Dual Stage Sintering System at Printed Electronics USA

XENON Corporation, world leader in Pulsed Light solutions, has announced it will be demonstrating its new S-2300 Dual Stage Sintering System at Printed Electronics USA in Santa Clara, California this November 19 and 20.

From Xenon Corporation 17 Nov 2014

Electro Scientific Industries Inks Acquisition Deal for Wuhan Topwin Optoelectronics Technology

Electro Scientific Industries, Inc., the premier source for innovative laser-based manufacturing solutions for the microtechnology industry, today announced that it has entered into a definitive agreement to acquire Wuhan Topwin Optoelectronics Technology Co., Ltd. (Topwin).

14 Nov 2014

Applied Materials Announces Collaboration to Develop Advanced Patterning Solution for Memory Devices

Applied Materials, Inc. today announced it collaborated with Samsung Electronics Co., Ltd. and PSK Inc., a Korea-based leader in photoresist removal, to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs.

From Applied Materials Inc. 11 Nov 2014

Researcher’s Nanoscale Work Shows Promise to Transform Energy Production, Storage, and Lighting

An avid amateur astronomer during her childhood in Vukovar, Croatia, Silvija Gradeèak, associate professor in materials science and engineering, was not content observing the physical world only from a distance: “I discovered what I really liked about science were experiments, and having the ability to make something with my hands,” she says.

From Massachusetts Institute of Technology 10 Nov 2014

INVECAS to Operate SoC Design Service Centers to Provide Support for GLOBALFOUNDRIES Customers

GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing, design and technology solutions, today announced a partnership with INVECAS Inc., a newly formed design services provider focused on accelerating customer introduction of new products on leading-edge semiconductor process technologies.

7 Nov 2014

ANL Places $1.3 Million Order with CVD for UHV Deposition System

CVD Equipment Corporation, a leading provider of standard and custom chemical vapor deposition systems, today announced that it has received a $1.3 Million order from Argonne National Laboratory (ANL) to manufacture an ultrahigh vacuum (UHV) deposition system for the growth of multilayer Laue lenses used for nanoscale imaging.

From CVD Equipment Corporation 7 Nov 2014

ProPlus Design Solutions Releases Re-Innovated BSIMProPlus SPICE Modeling Platform for Nanometer Devices

ProPlus Design Solutions Inc., the SPICE modeling solutions leader and provider of the first giga-scale SPICE simulator and unique Design-for-Yield (DFY) solutions, today introduced the latest release (2014.2) of the re-innovated BSIMProPlus™, the leading SPICE modeling platform for nanometer devices.

From ProPlus Design Solutions, Inc. 6 Nov 2014

Tango Systems Publishes Results for Conformal Step Seed Layer Coverage for TSVs with 15:1 Aspect Ratio

Tango Systems Inc., a leading innovator in high-performance, cost-effective physical vapor deposition (PVD) systems, today announced it has published results for conformal step seed layer coverage for through silicon vias (TSVs) with a15:1 aspect ratio. This significant achievement represents the industry's highest TSV step coverage for interposers and 3D ICs. The results were achieved using Tango's flagship Axcela™ PVD platform.

6 Nov 2014

STMicroelectronics Starts Production of MEMS Sensors using THELMA60 Surface-Micromachining Fabrication Process

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, the world's top MEMS (Micro-Electro-Mechanical Systems) manufacturer and the leading supplier of MEMS for consumer and mobile1 as well as automotive applications2, today announced that it had started production of MEMS sensors using its newly qualified, proprietary THELMA60 (60µm Thick Epi-poly Layer for Micro-gyroscopes and Accelerometers) surface-micromachining fabrication process.

From STMicroelectronics 6 Nov 2014

Texas Instruments to Expand Manufacturing Capacity in Chengdu with 300mm Wafer Bumping Facility

Texas Instruments Incorporated (TI) today announced it will expand its manufacturing capacity in Chengdu, China, with a 300mm wafer bumping facility. The addition of this manufacturing process in Chengdu further increases TI's 300mm analog capacity and its ability to support customer demand.

6 Nov 2014

Nanofabrication News

XENON to Demonstrate S-2300 Dual Stage Sintering System at Printed Electronics USA

Electro Scientific Industries Inks Acquisition Deal for Wuhan Topwin Optoelectronics Technology

Applied Materials Announces Collaboration to Develop Advanced Patterning Solution for Memory Devices

Researcher’s Nanoscale Work Shows Promise to Transform Energy Production, Storage, and Lighting

INVECAS to Operate SoC Design Service Centers to Provide Support for GLOBALFOUNDRIES Customers

ANL Places $1.3 Million Order with CVD for UHV Deposition System

ProPlus Design Solutions Releases Re-Innovated BSIMProPlus SPICE Modeling Platform for Nanometer Devices

Tango Systems Publishes Results for Conformal Step Seed Layer Coverage for TSVs with 15:1 Aspect Ratio

STMicroelectronics Starts Production of MEMS Sensors using THELMA60 Surface-Micromachining Fabrication Process

Texas Instruments to Expand Manufacturing Capacity in Chengdu with 300mm Wafer Bumping Facility

Biochar-Modified Titanium Dioxide Nanocomposites for Enhanced Water Treatment

New Nanocage Material Removes Up to 90% of Toxic PFAS from Water

Enhancing Chitosan Films with Silanized Hexagonal Boron Nitride for Sustainable Applications

Study Shows Potential for New Treatments for Neurological and Inflammatory Diseases

Gold Nanoparticles to Restore Vision in Retinal Disorders

Overcoming Nanogold Production Challenges

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

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