Nanofabrication News

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Tango Systems Publishes Results for Conformal Step Seed Layer Coverage for TSVs with 15:1 Aspect Ratio

Tango Systems Inc., a leading innovator in high-performance, cost-effective physical vapor deposition (PVD) systems, today announced it has published results for conformal step seed layer coverage for through silicon vias (TSVs) with a15:1 aspect ratio. This significant achievement represents the industry's highest TSV step coverage for interposers and 3D ICs. The results were achieved using Tango's flagship Axcela™ PVD platform.

6 Nov 2014

STMicroelectronics Starts Production of MEMS Sensors using THELMA60 Surface-Micromachining Fabrication Process

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, the world's top MEMS (Micro-Electro-Mechanical Systems) manufacturer and the leading supplier of MEMS for consumer and mobile1 as well as automotive applications2, today announced that it had started production of MEMS sensors using its newly qualified, proprietary THELMA60 (60µm Thick Epi-poly Layer for Micro-gyroscopes and Accelerometers) surface-micromachining fabrication process.

From STMicroelectronics 6 Nov 2014

Texas Instruments to Expand Manufacturing Capacity in Chengdu with 300mm Wafer Bumping Facility

Texas Instruments Incorporated (TI) today announced it will expand its manufacturing capacity in Chengdu, China, with a 300mm wafer bumping facility. The addition of this manufacturing process in Chengdu further increases TI's 300mm analog capacity and its ability to support customer demand.

6 Nov 2014

Xilinx Introduces 20nm DSP-Optimized Kintex UltraScale KU115 FPGA

Xilinx, Inc. today announced the expansion of its 20 nm portfolio with shipment of the Kintex® UltraScale™ KU115 FPGA. As the flagship of the Kintex UltraScale family, the KU115 offers the highest DSP count available in a single programmable device, doubling the DSP resources previously available. This DSP-optimized KU115 FPGA targets data center compute acceleration and signal processing applications including data center, video and medical imaging, broadcast systems, and radar.

5 Nov 2014

Molecular Imprints Demonstrates Low Cost Nanopatterning Fabrication Process for High Performance Touch Sensors

Molecular Imprints Inc. (MII), the market and technology leader for nanopatterning solutions, today announced it has demonstrated a low cost fabrication process for high performance touch sensors for the display market using an innovative metal mesh structure.

5 Nov 2014

New 28nm Quad-Core Processor from Actions Semiconductor

Actions Semiconductor® Co., Ltd. today introduced a new quad-core system-on-a-chip (SoC) to provide primary processing, connectivity, enhanced battery life and other capabilities in computer tablets and set top boxes (STB). The new processor is most ideal for mid-tier, high volume Android® tablet manufacturer designs. It will be available in the USA, Asia, Europe and other locations in November 2014.

4 Nov 2014

Synopsys Offers DesignWare AEON FTP Trim NVM IP for TowerJazz 180nm SL Process Technology

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the availability of the silicon-proven DesignWare® AEON® Few Time Programmable (FTP) Trim Non-Volatile Memory (NVM) IP for TowerJazz 180-nanometer (nm) SL process technology.

From Synopsys, Inc. 31 Oct 2014

Nanotech Security Presents at Independently Organized TEDxRenfrewCollingwood

Nanotech Security Corp. today announced that Vice President Clint Landrock presented at TEDxRenfrewCollingwood. The independently organized TED event was held on October 24, 2014.

29 Oct 2014

Kilopass Successfully Ports OTP NVM Technology to TSMC's 16nm FinFET Process

Kilopass Technology Inc., a leading provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), announced today that it has successfully ported its one-time programmable (OTP) NVM technology to TSMC's 16 nanometer (nm) FinFET process.

29 Oct 2014

Synopsys IC Complier II Tool Enables Panasonic to Achieve Silicon Success with High-End Multimedia Chip

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that its IC Complier™ II place-and-route tool enabled Panasonic Corporation System LSI Business Division (Panasonic SoC) to achieve silicon success with their high-end multimedia chip.

From Synopsys, Inc. 29 Oct 2014

Nanofabrication News

Tango Systems Publishes Results for Conformal Step Seed Layer Coverage for TSVs with 15:1 Aspect Ratio

STMicroelectronics Starts Production of MEMS Sensors using THELMA60 Surface-Micromachining Fabrication Process

Texas Instruments to Expand Manufacturing Capacity in Chengdu with 300mm Wafer Bumping Facility

Xilinx Introduces 20nm DSP-Optimized Kintex UltraScale KU115 FPGA

Molecular Imprints Demonstrates Low Cost Nanopatterning Fabrication Process for High Performance Touch Sensors

New 28nm Quad-Core Processor from Actions Semiconductor

Synopsys Offers DesignWare AEON FTP Trim NVM IP for TowerJazz 180nm SL Process Technology

Nanotech Security Presents at Independently Organized TEDxRenfrewCollingwood

Kilopass Successfully Ports OTP NVM Technology to TSMC's 16nm FinFET Process

Synopsys IC Complier II Tool Enables Panasonic to Achieve Silicon Success with High-End Multimedia Chip

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Enhancing Material Properties through Nanotube Encapsulation

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

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