Nanofabrication News

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Xilinx Introduces 20nm DSP-Optimized Kintex UltraScale KU115 FPGA

Xilinx, Inc. today announced the expansion of its 20 nm portfolio with shipment of the Kintex® UltraScale™ KU115 FPGA. As the flagship of the Kintex UltraScale family, the KU115 offers the highest DSP count available in a single programmable device, doubling the DSP resources previously available. This DSP-optimized KU115 FPGA targets data center compute acceleration and signal processing applications including data center, video and medical imaging, broadcast systems, and radar.

5 Nov 2014

Molecular Imprints Demonstrates Low Cost Nanopatterning Fabrication Process for High Performance Touch Sensors

Molecular Imprints Inc. (MII), the market and technology leader for nanopatterning solutions, today announced it has demonstrated a low cost fabrication process for high performance touch sensors for the display market using an innovative metal mesh structure.

5 Nov 2014

New 28nm Quad-Core Processor from Actions Semiconductor

Actions Semiconductor® Co., Ltd. today introduced a new quad-core system-on-a-chip (SoC) to provide primary processing, connectivity, enhanced battery life and other capabilities in computer tablets and set top boxes (STB). The new processor is most ideal for mid-tier, high volume Android® tablet manufacturer designs. It will be available in the USA, Asia, Europe and other locations in November 2014.

4 Nov 2014

Synopsys Offers DesignWare AEON FTP Trim NVM IP for TowerJazz 180nm SL Process Technology

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the availability of the silicon-proven DesignWare® AEON® Few Time Programmable (FTP) Trim Non-Volatile Memory (NVM) IP for TowerJazz 180-nanometer (nm) SL process technology.

From Synopsys, Inc. 31 Oct 2014

Nanotech Security Presents at Independently Organized TEDxRenfrewCollingwood

Nanotech Security Corp. today announced that Vice President Clint Landrock presented at TEDxRenfrewCollingwood. The independently organized TED event was held on October 24, 2014.

29 Oct 2014

Kilopass Successfully Ports OTP NVM Technology to TSMC's 16nm FinFET Process

Kilopass Technology Inc., a leading provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), announced today that it has successfully ported its one-time programmable (OTP) NVM technology to TSMC's 16 nanometer (nm) FinFET process.

29 Oct 2014

Synopsys IC Complier II Tool Enables Panasonic to Achieve Silicon Success with High-End Multimedia Chip

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that its IC Complier™ II place-and-route tool enabled Panasonic Corporation System LSI Business Division (Panasonic SoC) to achieve silicon success with their high-end multimedia chip.

From Synopsys, Inc. 29 Oct 2014

Everspin, GLOBALFOUNDRIES Collaborate to Build Fully Processed 300mm Wafers with MTJ ST-MRAM Technology

Everspin Technologies, Inc., the world's leading developer and manufacturer of discrete and embedded MRAM, today announced that the company has partnered with GLOBALFOUNDRIES to build fully processed 300mm wafers with Everspin’s magnetic tunnel junction (MTJ) Spin-Torque Magnetoresistive Random-Access Memory (ST-MRAM) technology, starting with GLOBALFOUNDRIES 40 nanometer and 28 nanometer Low Power CMOS platforms.

28 Oct 2014

In-Depth Study Report on Current State of Global CVD Diamond Industry

Research and Markets has announced the addition of the "Global CVD Diamond Industry Report 2014" report to their offering.

28 Oct 2014

Maxscend Bluetooth RF IP Silicon Proven on SMIC's 55nm Low Leakage Logic Process

Semiconductor Manufacturing International Corporation ("SMIC") and Maxscend Technologies Inc., a RF IP company based in China, announced that Maxscend Bluetooth RF IP has been silicon proven on SMIC's 55nm Low Leakage (LL) logic process. This IP has now been integrated into one of SMIC customers' product tape-out.

From Semiconductor Manufacturing International Corporation (SMIC) 27 Oct 2014

Nanofabrication News

Xilinx Introduces 20nm DSP-Optimized Kintex UltraScale KU115 FPGA

Molecular Imprints Demonstrates Low Cost Nanopatterning Fabrication Process for High Performance Touch Sensors

New 28nm Quad-Core Processor from Actions Semiconductor

Synopsys Offers DesignWare AEON FTP Trim NVM IP for TowerJazz 180nm SL Process Technology

Nanotech Security Presents at Independently Organized TEDxRenfrewCollingwood

Kilopass Successfully Ports OTP NVM Technology to TSMC's 16nm FinFET Process

Synopsys IC Complier II Tool Enables Panasonic to Achieve Silicon Success with High-End Multimedia Chip

Everspin, GLOBALFOUNDRIES Collaborate to Build Fully Processed 300mm Wafers with MTJ ST-MRAM Technology

In-Depth Study Report on Current State of Global CVD Diamond Industry

Maxscend Bluetooth RF IP Silicon Proven on SMIC's 55nm Low Leakage Logic Process

Biochar-Modified Titanium Dioxide Nanocomposites for Enhanced Water Treatment

New Nanocage Material Removes Up to 90% of Toxic PFAS from Water

Enhancing Chitosan Films with Silanized Hexagonal Boron Nitride for Sustainable Applications

Study Shows Potential for New Treatments for Neurological and Inflammatory Diseases

Gold Nanoparticles to Restore Vision in Retinal Disorders

Overcoming Nanogold Production Challenges

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

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