Nanofabrication News

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Major Advance in Implementation of ETPN Nanomedicine Translation Hub

A major step in implementing the ETPN Translation Hub has been reached, with three European projects entering the finalisation stage of their EU Grant Agreements. The project ENATRANS is for networking of SMEs in the nano-biomedical sector and supporting the SMEs with getting their products from the laboratory phase to the clinical applications.

16 Oct 2014

Tortech Nanofibres Installs Additional Capacity for Manufacture of Nonwoven Carbon Nanotube Sheets

Tortech Nanofibres, a subsidiary of Plasan, today announces the installation of additional capacity for the manufacture of its nonwoven carbon nanotube (CNT) sheet at its manufacturing facility. This will more than triple output once full commissioning is completed in the next few months and is an important step towards a full scale industrial manufacturing capability.

15 Oct 2014

New Report on Lithography, Deposition, and Etch Market Analysis for Flip Chip/WLP Manufacturing

Flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computer peripherals. Wafer-level packaging (WLP), the fabrication of the package directly on the wafer, is experiencing exceptional growth and stands out as one of the bright growth areas in electronics today.

14 Oct 2014

TSMC Honors Cadence with Partner of the Year Awards for Soft IP and 16nm FinFET Plus Solutions

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that it has won two TSMC Partner of the Year awards during the TSMC Open Innovation Platform® (OIP) Ecosystem Forum. Cadence was presented with awards for both Soft IP and joint development of 16nm FinFET Plus (16FF+) design infrastructure.

From Cadence Design Systems 10 Oct 2014

Synopsys Honored with TSMC Partner of the Year Award for Interface IP and Joint Development of 16-nm FinFET Plus Design Infrastructure

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that TSMC is recognizing Synopsys with their "2014 Partner of the Year" award in the areas of: Interface IP and Joint Development of 16-nm FinFET Plus Design Infrastructure.

From Synopsys, Inc. 9 Oct 2014

New Automated High-Vacuum Wafer Bonding System from EV Group

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®580 ComBond®¯a high-vacuum wafer bonding system, which enables electrically conductive and oxide-free covalent bonds at room temperature.

8 Oct 2014

New Method to Create Surfaces on Which Droplets of Desired Shapes Can Form Spontaneously

MIT researchers have developed a new way of creating surfaces on which droplets of any desired shape can spontaneously form. They say this approach could lead to new biomedical assay devices and LED display screens, among other applications.

8 Oct 2014

CEATEC Japan: ITRI and Komori Report Results from One-Step Roll-to-Roll Metal Mesh Printing Technology

ITRI and Komori disclose the collaboration results in one-step roll-to-roll metal mesh printing technology at 2014 CEATEC Japan from October 7th to 11th. The two parties will demonstrate a one-step printing technology for 11.6" touch panels with 5µm metal mesh and 30µm frame wires as well as 3µm printing capabilities.

7 Oct 2014

ARMv8-A Processor IP to be Optimized for TSMC 10FinFET Process Technology

ARM® and TSMC today announced a new multi-year agreement that will deliver ARMv8-A processor IP optimized for TSMC 10FinFET process technology. Because of the success in scaling from 20SoC to 16FinFET, ARM and TSMC have decided to collaborate again for 10FinFET. This early pathfinding work will provide valuable learning to enable physical design IP and methodologies in support of customers to tape-out 10FinFET designs as early as Q4 2015.

6 Oct 2014

NSF Awards Grants to Investigate 2-D Layered Materials Beyond Graphene

Graphene, a form of carbon in which a single layer of atoms forms a two-dimensional, honeycomb crystal lattice, conducts electricity and heat efficiently and interacts with light in unusual ways. These properties have led to worldwide efforts in exploring its use in electronics, photonics and many other applications.

1 Oct 2014

Nanofabrication News

Major Advance in Implementation of ETPN Nanomedicine Translation Hub

Tortech Nanofibres Installs Additional Capacity for Manufacture of Nonwoven Carbon Nanotube Sheets

New Report on Lithography, Deposition, and Etch Market Analysis for Flip Chip/WLP Manufacturing

TSMC Honors Cadence with Partner of the Year Awards for Soft IP and 16nm FinFET Plus Solutions

Synopsys Honored with TSMC Partner of the Year Award for Interface IP and Joint Development of 16-nm FinFET Plus Design Infrastructure

New Automated High-Vacuum Wafer Bonding System from EV Group

New Method to Create Surfaces on Which Droplets of Desired Shapes Can Form Spontaneously

CEATEC Japan: ITRI and Komori Report Results from One-Step Roll-to-Roll Metal Mesh Printing Technology

ARMv8-A Processor IP to be Optimized for TSMC 10FinFET Process Technology

NSF Awards Grants to Investigate 2-D Layered Materials Beyond Graphene

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Enhancing Material Properties through Nanotube Encapsulation

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

Sponsored Content

Characterization of Active Pharmaceutical Ingredients, Injectables, and Proteins

The Future of Wound Care: Why Nanofibers are Key to Accelerated Healing

The Evolution of Lipid Nanoparticles

How Emulsion Electrospinning is Transforming Materials