Nanofabrication News

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Toshiba and SanDisk Begin Production in Second Phase of Fab 5 with 15nm NAND Flash Memory Process Technology

Toshiba Corporation and SanDisk Corporation today celebrated the opening of the second phase of the No. 5 semiconductor fabrication facility (Fab 5) and the start of construction of the new No. 2 fabrication facility (Fab 2) at Yokkaichi Operations, Toshiba’s NAND Flash memory plant in Mie prefecture, Japan.

9 Sep 2014

QuickLogic ArcticLink 3 S2 Ultra-Low Power Sensor Hub Leverages GLOBALFOUNDRIES’ 65nm Process Technology

QuickLogic Corporation, the innovator of ultra-low power programmable Customer Specific Standard Products (CSSPs), and GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announc...

9 Sep 2014

Working OTP Bit Cells Demonstrated by Sidense in TSMC 16nm FinFET Technology

Sidense Corp., a leading developer of non-volatile memory OTP IP cores, today announced that it successfully demonstrated read and write capability for its 1T-OTP bit-cell architecture on test silicon fabricated in a 16nm CMOS FinFET process.

5 Sep 2014

Veeco Launches TurboDisc EPIK700 GaN Metal Organic Chemical Vapor Deposition system

Veeco Instruments Inc. introduced today the new TurboDisc® EPIK700™ Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) system that combines the industry’s highest productivity and best-in-class yields with low cost of operation, further enabling lower manufacturing costs for light emitting diodes (LEDs) for general lighting applications.

5 Sep 2014

ProPlus' BSIMProPlus Modeling Platform Deployed for Samsung Electronics’ 14-nm FinFET SPICE Modeling

ProPlus Design Solutions, Inc. today announced Samsung Electronics has extended its long-term partnership with ProPlus through the deployment of ProPlus' BSIMProPlus modeling platform for its 14-nanometer (nm) FinFET SPICE modeling.

4 Sep 2014

Kilopass Announces Successful TSMC9000 Qualification of XPM OTP Antifuse eNVM IP Core

Kilopass Technology Inc., a leading provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), today announced successful TSMC9000 qualification of its XPM one-time programmable (OTP) antifuse eNVM IP core.

4 Sep 2014

Innovative Method to Build Hybrid Nanostructures and Plasmon-Driven Photocatalysts

An innovative synthesis method developed by a group of researchers at the University of Maryland (UMD) allows creating hybrid nanostructures by joining different nanoparticles using an ‘intermedium’ or connector nanoparticle.

3 Sep 2014

Himax Imaging to Develop Next Gen Smart Phone Cameras Using TPSCo’s 1.12um-pixel CIS 65nm Process

TowerJazz, the global specialty foundry leader, and TowerJazz Panasonic Semiconductor Co., Ltd. (TPSCo) today announced its first major third party CMOS image sensor (CIS) customer, Himax Imaging, Inc., a subsidiary of Himax Technologies, Inc., that is developing its next generation high end cameras for smart phone applications using TPSCo’s state of the art 1.12um-pixel CMOS image sensor (CIS) 65nm process.

30 Aug 2014

NSF Awards UCLA $2M Grant for Study of Nanoscale Two-Dimensional Layered Materials

A team of UCLA researchers has received a $2-million, four-year grant from the National Science Foundation (NSF) Office of Frontiers in Research and Innovation to explore new approaches to assembling nanoscale materials for use in a variety of manufacturing and research applications.

From University of California, Los Angeles 30 Aug 2014

Altera Plans Mil Temp Qualification for 20nm Arria 10 FPGAs and SoCs

Altera Corporation today announced military temperature (Mil Temp) qualification plans for its newest 20 nm Arria® 10 FPGAs and SoCs, which will be qualified for extreme temperature environments (-55C to 125C ambient). In addition to the ratings, Altera can provide guidelines on speed grades, protocols, and external memory interfaces best suited to specific applications.

28 Aug 2014

Nanofabrication News

Toshiba and SanDisk Begin Production in Second Phase of Fab 5 with 15nm NAND Flash Memory Process Technology

QuickLogic ArcticLink 3 S2 Ultra-Low Power Sensor Hub Leverages GLOBALFOUNDRIES’ 65nm Process Technology

Working OTP Bit Cells Demonstrated by Sidense in TSMC 16nm FinFET Technology

Veeco Launches TurboDisc EPIK700 GaN Metal Organic Chemical Vapor Deposition system

ProPlus' BSIMProPlus Modeling Platform Deployed for Samsung Electronics’ 14-nm FinFET SPICE Modeling

Kilopass Announces Successful TSMC9000 Qualification of XPM OTP Antifuse eNVM IP Core

Innovative Method to Build Hybrid Nanostructures and Plasmon-Driven Photocatalysts

Himax Imaging to Develop Next Gen Smart Phone Cameras Using TPSCo’s 1.12um-pixel CIS 65nm Process

NSF Awards UCLA $2M Grant for Study of Nanoscale Two-Dimensional Layered Materials

Altera Plans Mil Temp Qualification for 20nm Arria 10 FPGAs and SoCs

Biochar-Modified Titanium Dioxide Nanocomposites for Enhanced Water Treatment

New Nanocage Material Removes Up to 90% of Toxic PFAS from Water

Enhancing Chitosan Films with Silanized Hexagonal Boron Nitride for Sustainable Applications

Study Shows Potential for New Treatments for Neurological and Inflammatory Diseases

Gold Nanoparticles to Restore Vision in Retinal Disorders

Overcoming Nanogold Production Challenges

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

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