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New Applied Materials’ CMP System Provides Wafer Polishing with Nano Precision for FinFET and 3D NAND Applications

New Applied Materials’ CMP System Provides Wafer Polishing with Nano Precision for FinFET and 3D NAND Applications

Microelectronics Equipment Manufacturer, SPTS Technologies, to be Acquired by Orbotech

Microelectronics Equipment Manufacturer, SPTS Technologies, to be Acquired by Orbotech

Suny CNSE/ SUNY IT to Present on sub 10nm Chip Design at SEMICON West 2014

Suny CNSE/ SUNY IT to Present on sub 10nm Chip Design at SEMICON West 2014

SOS Molecules Corralled Into Nanofabricated Patches Trap Membrane-Associated Ras Molecules

SOS Molecules Corralled Into Nanofabricated Patches Trap Membrane-Associated Ras Molecules

SMIC, Qualcomm Partner on 28nm Wafer Production for Snapdragon Processors

SMIC, Qualcomm Partner on 28nm Wafer Production for Snapdragon Processors

X-ray Fluorescence Spectroscopy Analyzes Japanese Paper Screens Gilded with Nanometer Scale Gold Leaf

X-ray Fluorescence Spectroscopy Analyzes Japanese Paper Screens Gilded with Nanometer Scale Gold Leaf

NSF Awards Grant for Study of Complex Physical and Chemical Reactions in Lithography Systems

NSF Awards Grant for Study of Complex Physical and Chemical Reactions in Lithography Systems

Speakers Announced for Oxford Instruments Seminar at IOP in Beijing

Speakers Announced for Oxford Instruments Seminar at IOP in Beijing

Print Performance Studies Compare Electroform and Laser-Cut Stencils

Print Performance Studies Compare Electroform and Laser-Cut Stencils

High-Tech Embossing Used to Produce Finer Results in Forming Silver Nanostructures

High-Tech Embossing Used to Produce Finer Results in Forming Silver Nanostructures

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