Nanofabrication News

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New Encapsulated Wafer Level Chip Scale Package from STATS ChipPAC

STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"), a leading provider of advanced semiconductor packaging and test services, today introduced encapsulated Wafer Level Chip Scale Package (eWLCSP™), an innovative packaging technology that raises the industry standard of durability for Wafer Level Chip Scale Packaging (WLCSP).

28 May 2014

Nanocrystallometry Enables Direct Control of Nano-World in Motion

Researchers have announced the first ever method for controlling the growth of metal-crystals from single atoms.

28 May 2014

SPTS Technologies Launches Rapier XE System for 300mm Wafer Silicon Etching

SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced the launch of its Rapier XE system for 300mm wafer silicon etching.

From SPTS Technologies 26 May 2014

KLA-Tencor Introduces EUV-compatible Teron SL650 Reticle Inspection System for IC Fabs

Today, KLA-Tencor Corporation announced the Teron™ SL650, a new reticle quality control solution for IC fabs that supports 20nm design nodes and beyond.

21 May 2014

Cadence DDR4 PHY IP Built on TSMC 16nm FinFET Process Now Available

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced immediate availability of DDR4 PHY IP (intellectual property) built on TSMC's 16nm FinFET process.

From Cadence Design Systems 20 May 2014

FUJIFILM Achieves New Record in Areal Data Density using NANOCUBIC and BaFe Particle Technologies

Citing its use of proprietary NANOCUBIC™ and Barium Ferrite (BaFe) particle technologies, FUJIFILM Recording Media U.S.A., Inc., a subsidiary of FUJIFILM Corporation, the leading global manufacturer of data storage media, today announced that in conjunction with IBM, a new record in areal data density of 85.9 billion bits per square inch on cost-efficient linear magnetic particulate tape has been achieved.

20 May 2014

Novel Nano Crystalline Coating Shows Exceptional Resistance to High Temperatures

Solar thermal panels developed at EPFL are are dressed up in unique and patented new materials. Researchers created a stronger black coating that retains its original color and thereby its absorption properties much longer than traditional panels.

19 May 2014

New Advanced IC technology R&D Institution Created in China

China's largest and most advanced semiconductor foundry – Semiconductor Manufacturing International Corporation, today announced that SMIC, Wuhan Xinxin, Tsinghua University, Beijing University, Fudan University and the Chinese Academy of Sciences and Microelectronics have collaborated to setup the "IC Advanced Technology Research Institute" to create the most advanced IC technology research and development institution in China.

From Semiconductor Manufacturing International Corporation (SMIC) 19 May 2014

Engineers Grow Semiconductor Nanowires and Bridges on Silicon for Advanced Electronics

A new approach to integrated circuits, combining atoms of semiconductor materials into nanowires and structures on top of silicon surfaces, shows promise for a new generation of fast, robust electronic and photonic devices.

16 May 2014

Xilinx Commences Shipment of Virtex UltraScale All Programmable FPGA

Xilinx, Inc. today announced the first customer shipment of the Virtex® UltraScale™ VU095 All Programmable FPGA, and the expansion of the industry's only 20nm high-end family to enable single chip implementation of 400G and 500G applications.

15 May 2014