Nanofabrication News

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Researchers Grow Vertically Aligned Carbon Nanofibers Using Airbrushing Techniques

Researchers from North Carolina State University used airbrushing techniques to grow vertically aligned carbon nanofibers on several different metal substrates, opening the door for incorporating these nanofibers into gene delivery devices, sensors, batteries and other technologies.

From North Carolina State University 12 Sep 2013

Micrologic's New nanoRV Release Supports Innovative Newest FinFET Technology

Micrologic Design Automation, Inc. ("MDA"), a leader in software development for electronic manufacturers, today announced the new release of its nanoRV tool for enhanced reliability and performance of custom a...

12 Sep 2013

D2S Extends Partnership with NuFlare to Accelerate Deployment of eBeam Technologies

D2S®, a supplier of computational design platforms, today announced that it has extended its partnership with NuFlare Technology, a world leader in electron beam (eBeam) mask writing systems, to accelerate the deployment of eBeam technologies that reduce write times and improve the accuracy of advanced photomasks for future design nodes leveraging general purpose graphic processing unit (GPGPU) acceleration.

11 Sep 2013

eBeam Initiative Completes Second Annual Survey on Photomask Technology

The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced the completion of the second annual eBeam Initiative survey. 28 member companies from across the photomask supply chain participated in the survey.

11 Sep 2013

Synopsys Custom Design Solution Receives TSMC Certification for 16-nm FinFET Process DRM V0.5

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced TSMC's certification of Synopsys' Laker® custom design solution for the TSMC 16-nanometer (nm) FinFET process Design Rule Manual (DRM) V0.5 as well as the availability of a 16-nm interoperable process design kit (iPDK) from TSMC.

From Synopsys, Inc. 10 Sep 2013

Synopsys Introduces 28-nm DesignWare HDMI 2.0 TX/RX IP Solutions

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today launched its DesignWare® HDMI 2.0 TX/RX IP solutions, including controller, PHY, and example Linux drivers to reduce designers' integration risk and time-to-market.

From Synopsys, Inc. 6 Sep 2013

HashFast’s GN Bitcoin Network Transaction Verification ASIC Successfully Tapes Out on TSMC’s 28HPM Process

HashFast Technologies and design and manufacturing operations partner Uniquify today confirmed that HashFast’s Golden Nonce (GN) Bitcoin network transaction verification Application Specific Integrated Circuit (ASIC) has successfully taped out on TSMC’s 28HPM process.

6 Sep 2013

Unit Cells in Nanostructured, Hollow Ceramic Scaffolds Display Remarkable Strength

The lightweight skeletons of organisms such as sea sponges display a strength that far exceeds that of manmade products constructed from similar materials. Scientists have long suspected that the difference has to do with the hierarchical architecture of the biological materials—the way the silica-based skeletons are built up from different structural elements, some of which are measured on the scale of billionths of meters, or nanometers.

6 Sep 2013

Bruker Introduces New LumiMap Electroluminescence System for HB-LED epi Wafer Process Metrology

At the 15th China International Optoelectronic Exposition (CIOE 2013), Bruker introduced the new LumiMap™ Electroluminescence System for uncompromised HB-LED epi wafer process metrology. LumiMap joins a suite of...

From Bruker Nano Surfaces and Metrology 5 Sep 2013

EVG Introduces Polymer NanoFill Via-Filling Process for 3D-IC/TSV Semiconductor Packaging

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled a new polymer via-filling process for 3D-IC/through-silicon-via (TSV) semiconductor packaging applications.

From EV Group 5 Sep 2013

Nanofabrication News

Researchers Grow Vertically Aligned Carbon Nanofibers Using Airbrushing Techniques

Micrologic's New nanoRV Release Supports Innovative Newest FinFET Technology

D2S Extends Partnership with NuFlare to Accelerate Deployment of eBeam Technologies

eBeam Initiative Completes Second Annual Survey on Photomask Technology

Synopsys Custom Design Solution Receives TSMC Certification for 16-nm FinFET Process DRM V0.5

Synopsys Introduces 28-nm DesignWare HDMI 2.0 TX/RX IP Solutions

HashFast’s GN Bitcoin Network Transaction Verification ASIC Successfully Tapes Out on TSMC’s 28HPM Process

Unit Cells in Nanostructured, Hollow Ceramic Scaffolds Display Remarkable Strength

Bruker Introduces New LumiMap Electroluminescence System for HB-LED epi Wafer Process Metrology

EVG Introduces Polymer NanoFill Via-Filling Process for 3D-IC/TSV Semiconductor Packaging

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Enhancing Material Properties through Nanotube Encapsulation

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

Sponsored Content

Characterization of Active Pharmaceutical Ingredients, Injectables, and Proteins

The Future of Wound Care: Why Nanofibers are Key to Accelerated Healing

The Evolution of Lipid Nanoparticles

How Emulsion Electrospinning is Transforming Materials