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Graphene NanoChem Announce Re-Opening of Lahad Datu Chemical Plant

Graphene NanoChem (AIM: GRPH), the performance nanochemicals and advanced materials company, is pleased to announce that Zurex Corporation Sdn Bhd, its wholly-owned subsidiary, has today resumed operations at its Lahad D...

From Graphene NanoChem 24 Oct 2013

New Cryogen-free Micro-Kelvin Refrigerator Developed by Royal Holloway University and Oxford Instruments Omicron Nanoscience

New groundbreaking cryogen-free micro-Kelvin refrigerator jointly developed by Oxford Instruments and Royal Holloway University of London. Oxford Instruments and Royal Holloway University of London (RHUL) have jointly...

From Oxford Instruments Nanoscience 24 Oct 2013

SUNY CNSE Unveils Plans for its Sixth Annual Celebration of NANOvember

In accordance with Governor Andrew Cuomo's high-tech growth strategy that is making New York the global hub for the nanotechnology industry, the SUNY College of Nanoscale Science and Engineering (CNSE) today unveiled plans for its sixth annual celebration of NANOvember, highlighted by an unmatched statewide outreach effort that will share the fascinating world of nanoscale education and research - as well as its significant educational and economic impact and opportunity - with thousands of New Yorkers in locations across the state.

From College of Nanoscale Science and Engineering, University at Albany 23 Oct 2013

CEA-Leti and Capsum Announce First Commercial Use of Lipidots Nanovector Technology

CEA-Leti and Capsum today announced that the successful transfer of Leti’s patented Lipidots® nanovector technology to Capsum for cosmetic applications has produced the first commercial use of the new technology.

From CEA-Leti 23 Oct 2013

Advantest Receives Orders for F7000 Series Electron Beam Lithography System

Advantest Corporation today announced that it has logged its first three orders for its new EB (electron beam) lithography system, the F7000, from the University of Tokyo, the University of Kyoto, and a semiconductor industry customer. The systems will be shipped within the fiscal year ending March 2014.

23 Oct 2013

No More Bibs: Stain Repellent Clothes Using Nanotechnology

Imagine eating dinner without worrying about your children getting dirty, bothering to put a bib on them or even caring about their soup splashing on their brand new clothes.

23 Oct 2013

Governor Cuomo Announces SUNY CNSE to Host Nano Job Fair on November 14

Governor Andrew M. Cuomo today announced that the SUNY College of Nanoscale Science and Engineering (CNSE) will host a Nano Job Fair on Thursday, November 14 at the CNSE Photovoltaic Manufacturing and Technology Development Facility (CNSE MDF) in Rochester, with targeted outreach now underway to attract qualified women, veterans and minority candidates to help fill more than 150 current and future openings.

From College of Nanoscale Science and Engineering, University at Albany 22 Oct 2013

Rigaku Innovative Technologies Unveils New EUV Lithography Product Line at 2013 International Symposium

Rigaku Innovative Technologies (RIT), a leading global supplier of multilayer optic technology for EUV lithography (EUVL), has unveiled its new line of EUVL solutions to support high volume EUV Lithography in conjunction with successful appearances at the 2013 International Symposium on Extreme Ultraviolet Lithography in Toyama, Japan.

22 Oct 2013

Cima NanoTech Sign Reseller Agreement with Precision Gasket Company

Cima NanoTech, a smart materials company and developer of SANTE® Self-Assembling Nanoparticle Technology, signed a reseller agreement with Precision Gasket Company (PGC), a leading manufacturing and materials application company.

22 Oct 2013

All Xilinx 28nm 3D IC Families Now Reach Volume Production

Xilinx, Inc. and TSMC today announced production release of the Virtex®-7 HT family, the industry's first heterogeneous 3D ICs in production. With this milestone, all Xilinx 28nm 3D IC families are now in volume production. These 28nm devices were developed on TSMC's Chip-on-Wafer-on-Substrate (CoWoS™) 3D IC process that produces significant silicon scaling, power and performance benefits by integrating multiple components on a single device.

From TSMC Taiwan Semiconductor Manufacturing Company 21 Oct 2013