MEMS - NEMS News

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Akustica Adds Four New High-Performance Analog Microphones to its HD Voice Product Line

Akustica, Inc., a Bosch Group company and leading provider of MEMS microphones, has added four new high-performance analog microphones to its high definition (HD) voice product line, including the AKU346, the industry’s smallest MEMS microphone to achieve 64dB SNR.

12 Mar 2014

CMC Microsystems and Micralyne Launch MicraGEM-Si™ Multi-Product Wafer Process

Researchers and companies creating innovative micro-electro mechanical systems (MEMS) to improve the functionality of new products in the communications, sensor and biotechnology markets now have the opportunity to design into an established fabrication process.

From Micralyne Inc. 12 Mar 2014

OFC/NFOEC 2014 to Feature Teledyne DALSA’s Latest Developments in MEMS/MOEMS Fabrication

Teledyne DALSA's Semiconductor foundry will feature its latest advancements in MEMS/MOEMS fabrication along with its High Voltage electrostatic actuator ICs at OFC/NFOEC 2014. Hosted at the Los Angeles Convention Center in California, the event runs from March 11-13, 2014, Teledyne DALSA will be located at booth 4653, North Hall.

From Teledyne Technologies Inc. 7 Mar 2014

Rough Coatings Can Prevent Tiny Parts from Adhering in Silicon-Based MEMS Machines

When a piece of gift-wrapping tape sticks to itself, it's frustrating, but when small parts in a microgear or micromotor stick together, an electronic device may not work well, if at all. Scientists now report in the journal ACS Applied Materials & Interfaces that rough zinc oxide coatings can prevent tiny silicon parts from adhering to each other.

From American Chemical Society 6 Mar 2014

MEMS Devices Proliferating in Mobile Devices, says New Market Report

Research and Markets has announced the addition of the "Concise Analysis of the International MEMS for Cell Phones and Tablets Market" report to their offering.

From Research and Markets 6 Mar 2014

New Market Report on MEMS for Cell Phones and Tablets

Research and Markets has announced the addition of the "Concise Analysis of the MEMS for Cell Phones and Tablets Market" report to their offering.

From Research and Markets 4 Mar 2014

Invenios Ambient Temperature Bonding Micro-System Production Process Now Supports Silicon, Metal Substrates

Invenios, an advanced technology micro-fabrication foundry specializing in microfluidics, MEMS, and 3D microstructures announced the addition of silicon and metal substrates to the range of materials utilizing the firm's innovative Ambient Temperature Bonding (ABT) micro-system production process for the permanent bonding of substrates, such as silicon-to-glass, metal-to-glass, and glass-to-glass at room temperatures without the use of electrostatics, heat or adhesives.

28 Feb 2014

New Report on Status of the MEMS Industry

Research and Markets has announced the addition of the "Executive Summary of the Status of the MEMS Industry" report to their offering.

From Research and Markets 27 Feb 2014

Integrated 7-Axis MEMS MotionTracking Platform from InvenSense

InvenSense, Inc., the leading provider of MotionTracking™ system on chip (SoC) and Sound devices, introduces the ICM-20728, the world’s first integrated 7-axis (3-axis gyroscope + 3-axis accelerometer + pressure sensor) single chip platform solution with onboard Digital Motion Processor (DMP™).

25 Feb 2014

IEEE-SA and MEMS Industry Group Enter MOU on eHealth and IoT

IEEE, the world’s largest professional organization dedicated to advancing technology for humanity, announced that the IEEE Standards Association (IEEE-SA) and MEMS Industry Group (MIG), the trade association advancing micro-electromechanical systems across global markets, have signed a memorandum of understanding (MOU) to help accelerate and broaden the adoption of globally relevant standards-based technologies for eHealth and the Internet of Things (IoT).

20 Feb 2014

MEMS - NEMS News

Akustica Adds Four New High-Performance Analog Microphones to its HD Voice Product Line

CMC Microsystems and Micralyne Launch MicraGEM-Si™ Multi-Product Wafer Process

OFC/NFOEC 2014 to Feature Teledyne DALSA’s Latest Developments in MEMS/MOEMS Fabrication

Rough Coatings Can Prevent Tiny Parts from Adhering in Silicon-Based MEMS Machines

MEMS Devices Proliferating in Mobile Devices, says New Market Report

New Market Report on MEMS for Cell Phones and Tablets

Invenios Ambient Temperature Bonding Micro-System Production Process Now Supports Silicon, Metal Substrates

New Report on Status of the MEMS Industry

Integrated 7-Axis MEMS MotionTracking Platform from InvenSense

IEEE-SA and MEMS Industry Group Enter MOU on eHealth and IoT

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