MEMS - NEMS News

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New Report on Global Nanoelectromechanical Systems Market

Research and Markets has announced the addition of the "Global Nanoelectromechanical Systems (NEMS) Market (2012 - 2022) by Applications, Products, Components, Materials" report to their offering.

From Research and Markets 22 Jul 2013

SiTime Introduces TempFlat MEMS That Eliminates Temperature Compensation

SiTime Corporation, the fastest growing semiconductor company, today introduced TempFlat™ MEMS. Until recently, all MEMS oscillators used compensation circuitry to stabilize the output frequency over temperature.

12 Jul 2013

Digi-Key Becomes Distributor for InvenSense's MEMS MotionTracking Solutions

InvenSense, Inc., the leading provider of MotionTracking™ devices and global electronics components distributor Digi-Key Corporation, the worldwide leader in electronic component selection, availability and delivery, announced a global distribution agreement.

10 Jul 2013

ClassOne Equipment Deploys Fully Refurbished Spray Solvent Tool at US-Based MEMS Fab

ClassOne Equipment announced today that it has recently sold, installed, and released into production a fully refurbished SEMITOOL Spray Solvent Tool (SST) at a top tier, US based MEMs Fab for its resist strip process.

9 Jul 2013

EV Group Unveils Fusion Wafer Bonding Platform for Manufacturing 3D-Integrated CMOS Image Sensors

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the latest version of its EVG®40NT automated measurement system, which is designed to work in concert with the company's GEMINI® FB fusion wafer bonding system to support the manufacture of next-generation 3D-integrated CMOS image sensors.

9 Jul 2013

EV Group Introduces High-Volume Room-Temperature Wafer Debonding Platform

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced its LowTemp™ debonding platform, which features three different room-temperature wafer-debonding processes and an extended material supply chain.

From EV Group 2 Jul 2013

New MEMS Absolute Pressure Sensor to be Released by OMRON

OMRON Corporation will release an absolute pressure sensor capable of accurately detecting 50cm altitudinal variations on July 29th 2013.

1 Jul 2013

SPTS Acquires XeF2-Based Release Etch Technology Provider, XACTIX

SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that it has acquired XACTIX, Inc., the market leading provider of xenon difluoride (XeF2)-based release etch technology. XACTIX is located in Pittsburgh, Pennsylvania.

26 Jun 2013

Teledyne DALSA to Present on MEMS Integrated Design for Inertial Sensors at MEMS China

Teledyne DALSA Semiconductor, a Teledyne Technologies company, will feature its new MIDIS™ platform in addition to its latest advancements in design and fabrication at MEMS China held June 25-27, 2013 at the Shanghai Everbright Convention and Exhibition Center in Shanghai, China. Teledyne DALSA will exhibit at booth 260.

24 Jun 2013

New Report on Global NEMS Market

Research and Markets has announced the addition of the "Global Nanoelectromechanical Systems (NEMS) Market (2012 - 2022) by Applications, Products, Components, Materials" report to their offering.

From Research and Markets 21 Jun 2013