MEMS - NEMS News

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TowerJazz to be Wafer Manufacturer for Infrared Sensing and Camera Devices

TowerJazz, the global specialty foundry leader, today announced it will be the wafer manufacturer for infrared sensing and camera devices using its proven specialty process technologies. In addition to traditional infrared applications, TowerJazz will facilitate expansion into other consumer markets such as gaming, personal security, and application driven platforms, market segments which are already well served by the company.

20 Jun 2013

CEA-Leti to Host Workshop on Future Technology Developments at SEMICON West 2013

CEA-Leti will host a workshop at SEMICON West 2013 on major technology developments in the next 10 years.

From CEA-Leti 20 Jun 2013

Micronit Announces Cleanroom Expansion to Meet Demands in MEMS and Microfluidics Fields

Micronit has recently expanded its cleanroom facilities both in space and state-of-the-art equipment. This is a result of a growing order portfolio and the introduction of new production techniques. With these additional cleanroom facilities, Micronit can now easily meet the demands and expectations of today and those of the future in the fields of Microfluidics and MEMS.

From Micronit Microfluidics BV 19 Jun 2013

Innovative Single-Wafer Photoresist and Residue Removal Technology for MEMS Markets

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, and Dynaloy, LLC, an international manufacturer of chemicals for the electronics industry and wholly owned subsidiary of Eastman Chemical Company, today introduced CoatsClean™-an innovative single-wafer photoresist and residue removal technology designed to address thick films and difficult-to-remove material layers for the 3D-ICs/through-silicon vias (TSVs), advanced packaging, microelectromechanical systems (MEMS) and compound semiconductor markets.

From EV Group 18 Jun 2013

Reverse Costing Analysis of ST’s LPS331AP MEMS-Based Pressure-Sensing Device

Research and Markets has announced the addition of the "STMicroelectronics LPS331AP - Reverse Costing Analysis" report to their offering.

From Research and Markets 17 Jun 2013

Fraunhofer EMFT Installs AltaCVD System for Poly-Silicon Film Deposition in MEMS Applications

Altatech, a subsidiary of Soitec, announced today that it has installed and qualified an AltaCVD system at the Fraunhofer Research Institution for Modular Solid State Technology EMFT in Munich where it will be used to deposit poly-silicon films for CMOS and MEMS applications. This repeat order from Fraunhofer EMFT reinforces the AltaCVD system’s leadership position in advanced material deposition for semiconductor applications.

14 Jun 2013

China’s GSMC Selects SPTS Rapier Etch System to Manufacture Inertial MEMS Devices

SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that it has secured an order from one of China’s leading foundries, Grace Semiconductor Manufacturing Corporation (GSMC). The SPTS Omega c2L Rapier etch system will be used to manufacture inertial MEMS devices in Shanghai, China.

12 Jun 2013

World’s First Integrated Industrial 6-Axis MEMS SoC from InvenSense

InvenSense, Inc., the leading provider of MotionTracking™ devices, announced a family of 6 Industrial MotionTracking solutions including 3-axis gyroscopes and integrated 6-axis gyroscopes plus accelerometers.

7 Jun 2013

TowerJazz, Cavendish Kinetics to Bring MEMS Tunable RF Solutions to Mobile Wireless Market

TowerJazz and Cavendish Kinetics today announced their collaboration to bring MEMS tunable RF solutions to the consumer mobile wireless market. The process technology combines the Cavendish NanoMech™ MEMS technology with the TowerJazz power CMOS process and custom RF interconnect in a single chip solution.

From Cavendish Kinetics 7 Jun 2013

Teledyne DALSA Introduces MIDIS 200 mm MEMS Fabrication Platform for Motion Sensing Devices

Teledyne DALSA Semiconductor, a Teledyne Technologies company and a world-leading pure-play MEMS foundry, today announced the availability of its new MIDIS 200 mm MEMS fabrication platform for motion sensing devices.

5 Jun 2013

MEMS - NEMS News

TowerJazz to be Wafer Manufacturer for Infrared Sensing and Camera Devices

CEA-Leti to Host Workshop on Future Technology Developments at SEMICON West 2013

Micronit Announces Cleanroom Expansion to Meet Demands in MEMS and Microfluidics Fields

Innovative Single-Wafer Photoresist and Residue Removal Technology for MEMS Markets

Reverse Costing Analysis of ST’s LPS331AP MEMS-Based Pressure-Sensing Device

Fraunhofer EMFT Installs AltaCVD System for Poly-Silicon Film Deposition in MEMS Applications

China’s GSMC Selects SPTS Rapier Etch System to Manufacture Inertial MEMS Devices

World’s First Integrated Industrial 6-Axis MEMS SoC from InvenSense

TowerJazz, Cavendish Kinetics to Bring MEMS Tunable RF Solutions to Mobile Wireless Market

Teledyne DALSA Introduces MIDIS 200 mm MEMS Fabrication Platform for Motion Sensing Devices

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Novel Method for Producing Superior Carbon Nanofibers via Additive Nanostructuring

Optimizing Methylene Blue Removal with Bovine Serum Albumin Nanoparticles

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

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