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Northrop Grumman Introduces MEMS Based Attitude and Heading Reference System

Northrop Grumman Corporation is introducing its new LCR-200 Attitude and Heading Reference System (AHRS), based on micro-electromechanical systems (MEMS) technology, at the Aircraft Electronics Association's International Convention and Trade Show, which takes place in Las Vegas from March 25-28.

26 Mar 2013

STMicroelectronics Offers THELMA MEMS Technology to Advance Motion-Sensing Applications

STMicroelectronics and CMP (Circuits Multi Projets®) today announced that ST's THELMA MEMS manufacturing process, the process ST uses for its industry-leading accelerometers and gyroscopes, which have shipped in billions of units, is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP.

From STMicroelectronics 20 Mar 2013

EXFO to Showcase MXS-9100 MEMS MxN Matrix Optical Switch at OFC/NFOEC 2013

EXFO Inc. announced today that it will be attending OFC/NFOEC 2013, March 17-21, 2013, in Anaheim, California, in order to demonstrate its test solution for deploying, validating and troubleshooting networks up to 100G in the field.

16 Mar 2013

EXFO and DiCon Fiberoptics Co-develop MXS-9100 MEMS Matrix Optical Switch

EXFO Inc. announces the launch of the MXS-9100, jointly developed with DiCon and available exclusively from EXFO. DiCon Fiberoptics' MXS-9100 MEMS MxN Matrix Optical Switch is optimized for use with EXFO systems and software control, and allows any M input fibers to connect to any N output fibers in a fully non-blocking manner.

15 Mar 2013

EV Group Installs 300-mm Wafer Bonding System for Top Chinese Semiconductor Foundry

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has installed a fully automated 300-mm system from EVG's Gemini® product family of integrated wafer bonding clusters to a leading Chinese semiconductor foundry.

From EV Group 14 Mar 2013

OFC/NFOEC 2013: Teledyne DALSA to Highlight MEMS/MOEMS Fabrication

Teledyne DALSA Semiconductor will feature its latest advancements in MEMS/MOEMS fabrication along with its innovative High Voltage electrostatic actuator ICs at OFC/NFOEC 2013, the world’s leading event for advancing optical solutions. Hosted at the Anaheim Convention Center, in Anaheim, CA, USA, the exposition will run from March 19-21, 2013 and Teledyne DALSA will be located at booth 3704.

12 Mar 2013

MEMSIC Fourth-Quarter Net Sales Decreases to $14.2 Million

MEMSIC, Inc., a leading MEMS sensing solution provider, today announced financial results for the fourth quarter ended December 31, 2012.

11 Mar 2013

Bruker Launches Scalable ContourGT-K 3D Optical Microscopes

Bruker today announced the launch of the new, scalable ContourGT-K 3D optical microscope for value-oriented, uncompromised bench-top metrology. Incorporating many of the advanced features of Bruker’s flagship optical metrology products, the ContourGT-K delivers unsurpassed Z-axis resolution across all fields of view and superior 2D/3D imaging capability for non-contact profile, roughness and thickness measurements on a wide range of surfaces.

From Bruker Nano Surfaces and Metrology 7 Mar 2013

ESI Releases UV Laser Drilling System for the Microtechnology Industry

Electro Scientific Industries, Inc., a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced the release of its Model 5335 UV Laser Drilling System.

From Electro Scientific Industries (ESI) 6 Mar 2013

Novel Technology for Room Temperature Covalent Wafer Bonding

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is developing equipment and process technology to enable covalent bonds at room temperature.

From EV Group 6 Mar 2013