STMicroelectronics, the world's leading supplier of MEMS (Micro-Electro-Mechanical Systems) devices for consumer and portable applications, has announced that it will develop and supply a wireless MEMS sensor that acts as a transducer, antenna and mechanical support for additional read-out electronics in a breakthrough platform developed by Swiss company Sensimed AG.
Micralyne Inc., a world-renowned, independent MEMS solutions company, has developed an Advanced Optical MEMS platform for the fiber communication industry that decreases the time it takes to bring a device to market and reduces development and operational costs.
Electro-mechanical sensors tell the airbag in your car to inflate and rotate your iPhone screen to match your position on the couch. Now a research group of Tel Aviv University's Faculty of Engineering is making the...
BreconRidge Corporation packaged and shipped over 90 Gallium-Nitride (GaN) modules to the Canadian Space Agency (CSA) as part of its corporate strategy to extend its core capabilities in next generation Micro Electronic ...
Capella Intelligent Subsystems, Inc. and Innovative Micro Technology, Inc. announced today the formation of a strategic foundry relationship.
The Soitec Group (Euronext Paris), the world's leading supplier of engineered substrates for the microelectronics industry, announced today that the company has entered into an agreement to supply silicon-on-insulator (SOI) substrates to CSMC Technologies Corporation ("CSMC"), a leading pure-play specialty analog foundry based in China.
Research and Markets (http://www.researchandmarkets.com/research/63b817/world_mems_players) has announced the addition of the "World MEMS Players Database 2010" directory to their offering.
World MEMS Players Databas...
MEMSIC, Inc. (NasdaqGM: MEMS), a leading MEMS sensing solution provider, announced today that the company has completed the construction of its new manufacturing facility and R&D center in Wuxi, China.
Seiko Instruments Inc. (SII) has succeeded in developing a high precision siliconbased MEMS resonator. In addition, SII, in collaboration with the Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), has also succeeded in the development of a new wafer level packaging technology for vacuum sealing MEMS devices.
ALLVIA, the first through-silicon via (TSV) foundry, in conjunction with Semiconductor International magazine, will broadcast a webcast on how to build silicon interposers with embedded capacitors in 3D stacked semiconductors.
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