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Research and Markets Adds Report on Inorganic and Composite Printed Electronics

Research and Markets has announced the addition of the "Inorganic and Composite Printed Electronics 2012-2022: Needs, Opportunities, Forecasts" report to their offering.

From Research and Markets 22 Jan 2014

Research Suggests Nanodevices in Microcircuits can Protect Themselves from Heat Generation

As smartphones, tablets and other gadgets become smaller and more sophisticated, the heat they generate while in use increases. This is a growing problem because it can cause the electronics inside the gadgets to fail.

22 Jan 2014

Experimental Evidence of SEUs Produced by Single Energetic Electrons in SRAM Semiconductors

As phones and other electronics shrink in size, they’ve grown in capabilities and ubiquitousness.

17 Jan 2014

ENIAC JU’s 63 Projects in Nanoelectronics Reach €2.86 Billion in Costs

The 63 ENIAC Joint Undertaking projects arising from 9 open and competitive calls for R&D proposals in nanoelectronics reach a total of 2.86 billion euro in eligible costs. They are supported by 490 million euro national and 444 million euro ENIAC JU contributions. The ENIAC JU reinvested its administrative cost savings into R&D therefore exceeding by 1% the initial budgetary allocation foreseen in the Council Regulation No 72/2008.

17 Jan 2014

ERC Awards Consolidator Grant to imec Researcher for SCALPEL Project

Imec, a world leading nanoelectronics research center, proudly announces that Prof. Dr. Liesbet Lagae, R&D Manager Life Science Technologies at imec and professor in Nanobio Physics at KU Leuven, has been awarded a Consolidator Grant for her research project SCALPEL by the European Research Council (ERC).

From IMEC 16 Jan 2014

SEMICON Korea: QuantumClean and ChemTrace to Exhibit at the 2014 Tradeshow

QuantumClean® and ChemTrace® today announced that they will be exhibiting at the SEMICON Korea tradeshow, held at the Coex in Seoul, South Korea from February 12th through February 14th, 2014.

15 Jan 2014

Fraunhofer ISIT Acquires EVG 850TB/DB Fully Automated Bonding/Debonding Equipment Solution

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the Fraunhofer Institute for Silicon Technology (ISIT) has purchased an EVG®850TB/DB fully automated bonding/debonding equipment solution. The system has been shipped and installed at Fraunhofer ISIT's facility in Itzehoe, Germany, where it is being used in the development and production of next-generation power devices, including PowerMOS and Insulated Gate Bipolar Transistors (IGBTs).

From EV Group 15 Jan 2014

Metamaterials Could be Designed to do ‘Photonic Calculus’

A new study by researchers at the University of Pennsylvania, The University of Texas at Austin and University of Sannio in Italy shows that metamaterials can be designed to do “photonic calculus” by working like an analog computer.

10 Jan 2014

Researchers Create World's Fastest Thin-Film Organic Transistors

Two university research teams have worked together to produce the world's fastest thin-film organic transistors, proving that this experimental technology has the potential to achieve the performance needed for high-resolution television screens and similar electronic devices.

9 Jan 2014

UMC Exceeds 15 Million Shipments for 55nm Display Driver ICs

United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced that it has surpassed 15 million shipments for customer small display driver ICs (SDDI) manufactured using the foundry's 55nm embedded high voltage (eHV) technology. The 55nm eHV process, utilized by customers to enable high-end, high-resolution smartphones, is being produced with excellent manufacturing yields in the foundry's 300mm fabs in Taiwan and Singapore.

From United Microelectronics Corporation 8 Jan 2014