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SilTerra and CMT Release MTP Embedded Non-Volatile Memory Solution in 110nm High Voltage Technology

SilTerra Malaysia Sdn. Bhd., a Malaysian home grown leading semiconductor wafer foundry, and Chip Memory Technology, Inc, an innovative memory IP design house, jointly announced today the production release of Multiple-Time-Programming (MTP) embedded non-volatile memory solution in SilTerra’s advanced 110nm High Voltage technology.

7 Nov 2013

Imec Announce R&D Collaboration For Sensor Array

Nanoelectronics research center imec announced today that the Howard Hughes Medical Institute (HHMI), the Allen Institute for Brain Science, the Gatsby Charitable Foundation, the Wellcome Trust, and University College Lo...

From IMEC 7 Nov 2013

Synopsys Launches Products in New DesignWare ARC HS Processor Family

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced availability of the first products in the new DesignWare® ARC® HS Processor Family.

From Synopsys, Inc. 6 Nov 2013

Researchers Create Transparent, Flexible Piano Using Graphene-Based Ink

Two prototypes – a detection device which users lasers to fight fraud, and a piano which demonstrates the potential of printed electronics – have been unveiled by Cambridge researchers.

6 Nov 2013

ProPlus Design Solutions to Feature FinFET-Ready DFY Products at Technology Symposiums

Will feature its FinFET-ready DFY products that range from nano-scale SPICE modeling to giga-scale SPICE simulations at the 2013 ProPlus Technology Symposiums in Shanghai, China, and Hsinchu City, Taiwan. Dr. Chenming Hu, TSMC distinguished professor of the Graduate School at the University of California, Berkeley, will be the keynote presenter at the Shanghai symposium and offer a perspective on the 3D FinFET transistor he and his team invented.

5 Nov 2013

Omnetics' Nano Miniature Connectors Provide High-Quality Signal Integrity for High-Speed Gigabit Signal Processing

Omnetics' Nano miniature connectors are designed and connected to impedance-controlled cable systems to provide high-quality signal integrity for high-speed Gigabit signal processing needs between components and systems in highly rugged environments. For more information, see http://www.omnetics.com/products/bilobe-dualrow/

From Omnetics Connector Corporation 4 Nov 2013

Toshiba Unveils New Embedded NAND Flash Memory Modules with 19nm Process Technology

Toshiba Corporation today announced the launch of new embedded NAND flash memory modules integrating NAND chips fabricated with 19nm second generation process technology. The module is fully compliant with the latest e•MMCTM [1] standard, and is designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and digital video cameras. Mass production will start from the end of November.

31 Oct 2013

PAMS Project Aims to Design Sub-Nanometer Range Electronic Components

Professor Angelika Kühnle and her work group at the Institute of Physical Chemistry at Johannes Gutenberg University Mainz (JGU) are participating in a new EU project focusing on information and communication technology. Over the next four years, a total of eight partners from six European countries will be involved in the "Planar Atomic and Molecular Scale Devices" (PAMS) project.

30 Oct 2013

sureCore’s SRAM IP Demonstrator Chip Taped Out in STMicroelectronics’ 28nm FD-SOI Process

sureCore Ltd has announced that it has taped out its low power SRAM IP demonstrator chip in STMicroelectronics’ 28nm Fully Depleted Silicon-on-Insulator (FD-SOI) process. The device will validate the benefits of sureCore’s patented array control and sensing scheme, which significantly lowers active power consumption to deliver greater than 50% power savings compared to current offerings in the same process.

30 Oct 2013

Abaxis Inc. and Lamdagen Corporation Announce Agreement to Integrate Plasmonic ELISA Technology onto Rotor-based Platforms

Abaxis, Inc., a medical products company manufacturing point-of-care blood instrumentation and consumables to the medical, research and veterinary markets, and privately-held LamdaGen Corporation, an optical biosensor co...

From LamdaGen Corporation 30 Oct 2013

Nanoelectronics News

SilTerra and CMT Release MTP Embedded Non-Volatile Memory Solution in 110nm High Voltage Technology

Imec Announce R&D Collaboration For Sensor Array

Synopsys Launches Products in New DesignWare ARC HS Processor Family

Researchers Create Transparent, Flexible Piano Using Graphene-Based Ink

ProPlus Design Solutions to Feature FinFET-Ready DFY Products at Technology Symposiums

Omnetics' Nano Miniature Connectors Provide High-Quality Signal Integrity for High-Speed Gigabit Signal Processing

Toshiba Unveils New Embedded NAND Flash Memory Modules with 19nm Process Technology

PAMS Project Aims to Design Sub-Nanometer Range Electronic Components

sureCore’s SRAM IP Demonstrator Chip Taped Out in STMicroelectronics’ 28nm FD-SOI Process

Abaxis Inc. and Lamdagen Corporation Announce Agreement to Integrate Plasmonic ELISA Technology onto Rotor-based Platforms

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Enhancing Material Properties through Nanotube Encapsulation

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

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The Evolution of Lipid Nanoparticles

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