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Flexible Electronic Circuit Boards Made Using Elastomeric Foams

Using foam substrates, EPFL scientists were able to make a flexible electronic circuit board. This discovery could lead to the creation of deformable and stretchable circuits.

16 Nov 2013

Surface Oxygen Used to Grow Large Single Graphene Crystals on Copper

When it comes to the growth of graphene — an ultrathin, ultrastrong, all-carbon material — it is survival of the fittest, according to researchers at The University of Texas at Austin.

15 Nov 2013

GSS Statistical Compact Model Extraction Tool Adopted by TSMC for TCAD Device Analysis

Gold Standard Simulations (GSS) revealed today that TSMC has adopted the company's advanced statistical compact model extraction tool Mystic for TCAD device analysis.

13 Nov 2013

Berkeley Design Automation’s AFS AMS Selected by IOsemi for RF Front-End Mixed-Signal Design Verification

Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that IO Semiconductor Inc. (IOsemi), a fabless semiconductor company developing high-performance RF front-end devices for multi-band, multi-mode cellular applications, has selected the company’s Analog FastSPICE™ AMS (AFS AMS) for RF front-end mixed-signal design verification.

13 Nov 2013

Xilinx Commences Shipment of UltraScale Devices on TSMC's 20nm Process Technology

Xilinx, Inc. today announced first customer shipment of the semiconductor industry's first 20nm product manufactured by TSMC, and the PLD industry's first 20nm All Programmable device. Xilinx UltraScale™ devices deliver an ASIC-class advantage with the industry's only ASIC-class programmable architecture coupled with the Vivado® ASIC-strength design suite and recently introduced UltraFast™ design methodology.

12 Nov 2013

Specialty Foundry, XMC, Opens Office in California’s Silicon Valley

XMC, a fast growing specialty foundry, today announced it has opened an office in California's Silicon Valley to support the growing interest and demand for its semiconductor manufacturing offerings. The office will be the base for front-line sales and business development efforts in North America. It will be headed by industry veteran Keng Wong, who has been named Associate Vice President of US Sales.

12 Nov 2013

Vishay Intertechnology Launches Two New 940 nm High-Speed Infrared Emitting Diodes in Compact Side-View Packages

Vishay Intertechnology, Inc. is broadening its optoelectronics portfolio with the introduction of two new 940 nm high-speed infrared emitting diodes in compact 3.2 mm by 2.51 mm by 1.2 mm clear SMD side-view packages. Based on GaAIAs surface emitter and multi quantum well (MQW) technologies, the VSMY14940 and VSMB14940 combine high radiant intensity and optical power with fast switching times.

8 Nov 2013

SilTerra and CMT Release MTP Embedded Non-Volatile Memory Solution in 110nm High Voltage Technology

SilTerra Malaysia Sdn. Bhd., a Malaysian home grown leading semiconductor wafer foundry, and Chip Memory Technology, Inc, an innovative memory IP design house, jointly announced today the production release of Multiple-Time-Programming (MTP) embedded non-volatile memory solution in SilTerra’s advanced 110nm High Voltage technology.

7 Nov 2013

Imec Announce R&D Collaboration For Sensor Array

Nanoelectronics research center imec announced today that the Howard Hughes Medical Institute (HHMI), the Allen Institute for Brain Science, the Gatsby Charitable Foundation, the Wellcome Trust, and University College Lo...

From IMEC 7 Nov 2013

Synopsys Launches Products in New DesignWare ARC HS Processor Family

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced availability of the first products in the new DesignWare® ARC® HS Processor Family.

From Synopsys, Inc. 6 Nov 2013

Nanoelectronics News

Flexible Electronic Circuit Boards Made Using Elastomeric Foams

Surface Oxygen Used to Grow Large Single Graphene Crystals on Copper

GSS Statistical Compact Model Extraction Tool Adopted by TSMC for TCAD Device Analysis

Berkeley Design Automation’s AFS AMS Selected by IOsemi for RF Front-End Mixed-Signal Design Verification

Xilinx Commences Shipment of UltraScale Devices on TSMC's 20nm Process Technology

Specialty Foundry, XMC, Opens Office in California’s Silicon Valley

Vishay Intertechnology Launches Two New 940 nm High-Speed Infrared Emitting Diodes in Compact Side-View Packages

SilTerra and CMT Release MTP Embedded Non-Volatile Memory Solution in 110nm High Voltage Technology

Imec Announce R&D Collaboration For Sensor Array

Synopsys Launches Products in New DesignWare ARC HS Processor Family

Gold Nanoparticles to Restore Vision in Retinal Disorders

Levidian and Zentek Seek to Establish Graphene-Integrated Filter Manufacturing Facility in the Middle East to Advance Cleaner, Safer Air

Biochar-Modified Titanium Dioxide Nanocomposites for Enhanced Water Treatment

New Nanocage Material Removes Up to 90% of Toxic PFAS from Water

Enhancing Chitosan Films with Silanized Hexagonal Boron Nitride for Sustainable Applications

Overcoming Nanogold Production Challenges

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

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