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Cadence Develops TSMC 16nm Custom Design Reference Flow

Cadence Design Systems, Inc., a leader in global electronic design innovation, announced today that its digital, custom and signoff tools have implemented methodology innovations that allow customers to achieve TSMC’s 16nm FinFET process benefits of higher performance, lower power consumption and smaller area.

From Cadence Design Systems 21 Sep 2013

Synopsys Offers DesignWare Interface IP on TSMC's 20-nm SoC Process

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the availability of a range of DesignWare Interface IP on TSMC's 20-nanometer (nm) system-on-chip (SoC) process.

From Synopsys, Inc. 20 Sep 2013

RFMD Debuts 6-inch GaN-on-SiC RF Technology

RFMD, a global leader in the design and manufacture of high-performance radio frequency solutions, today introduced the world's first 6-inch GaN-on-Silicon Carbide (SiC) wafers for manufacturing RF power transistors for both military and commercial use. The company is converting all GaN production and development to 6-inch diameter wafers using its existing high-volume, 6-inch GaAs foundry to reduce platform cost for the growing GaN device market.

20 Sep 2013

Avo Photonics to Provide Optofluidics Design Services for Molecular NanoTweezer System

Avo Photonics, specialists in opto-electronic systems requiring precision optical alignment, has been chosen by Optofluidics to provide system design and manufacturing services for their molecular NanoTweezer system.

19 Sep 2013

Entegris, SEMATECH Partner to Develop Advanced Nanoscale Particle Removal Processes for Wafers

Entegris, Inc., a leader in contamination control and materials handling technologies for highly advanced manufacturing environments, and SEMATECH announced they have partnered to move forward the development of advanced nanoscale particle removal processes and cleaning technologies for next-generation wafers and devices.

17 Sep 2013

Omnetics Completes Full Line of Nano-D Shaped Connectors for Miniature Printed Circuit Boards

Omnetics Connector Corporation has completed a full line of Nano-D shaped connectors designed for automatic and hand assembly for densely packed miniature printed circuit boards and certified for MIL-DTL-32139.

17 Sep 2013

Promising Environmentally-Friendly Electronic Alloy for Next-Generation ‘Phase-Change’ Memory Devices

A new, environmentally-friendly electronic alloy consisting of 50 aluminum atoms bound to 50 atoms of antimony may be promising for building next-generation "phase-change" memory devices, which may be the data-storage technology of the future, according to a new paper published in the journal Applied Physics Letters, which is produced by AIP Publishing.

16 Sep 2013

CNSE to Lead Development of Marcy Nanocenter

In accordance with Governor Andrew Cuomo’s strategic blueprint for growing nanotechnology industry jobs, companies, and investment across New York, the SUNY College of Nanoscale Science and Engineering (CNSE) and Mohawk Valley EDGE today announced an expanded partnership through which CNSE will lead development of the Marcy Nanocenter site by serving as the site end user.

From College of Nanoscale Science and Engineering, University at Albany 13 Sep 2013

New Opel Adam Features Freudenberg's Flexible Printed Circuit Board Technology

From starry headliners and new weight-saving engine components to air-intake and cabin filters, Freudenberg products are featured on a variety of vehicles exhibited at the International Auto Show (IAA) in Frankfurt from September 12 to 22.

12 Sep 2013

Cost-Effective Method Transforms Standard Paper into Moveable, Flexible Display

Recently at the 2013 IFA international trade show for consumer electronics and home appliances in Berlin, major electronics manufacturers displayed new types of displays that are thin, and even curved, but expensive.

12 Sep 2013