Nanoelectronics News

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STATS ChipPAC Partners with NTU to Develop Next Generation Semiconductor Packaging Technologies

STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company”), a leading provider of advanced semiconductor packaging and test services, today announced a collaborative partnership with Nanyang Technological University (NTU) focused on generating breakthrough innovations in next generation packaging technologies.

13 Aug 2013

GreenCentre Canada Incorporates Precision Molecular Design Corporation

GreenCentre Canada has recently incorporated its third spinoff company, Precision Molecular Design Corporation. Based on a technology invented at Carleton University, Precision Molecular Design’s proprietary ALD precursors enable “greener” production of smaller and faster microchips for the semiconductor industry.

9 Aug 2013

OmniVision Deploys ProPlus’ NanoSpice for Simulation of Analog Designs in CMOS Imaging Ics

ProPlus Design Solutions, Inc. announced today that OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, has deployed ProPlus’ NanoSpice™ for the simulation of analog designs used in its CMOS imaging integrated circuits (ICs).

From ProPlus Design Solutions, Inc. 8 Aug 2013

WITec's RayShield Coupler Offers Raman Data at Low Wavenumbers

WITec’s RayShield Coupler is now available for the alpha300 and alpha500 microscope series supplied by LOT-QuantumDesign. It allows the acquisition of Raman spectra at wavenumbers down to below 10 rel. cm-1.

From Quantum Design UK and Ireland Ltd 7 Aug 2013

Oxford Instruments Launches Four New Modules for its AZtec Microanalysis System at M&M 2013

Oxford Instruments, a leading supplier of microanalysis systems, has launched four new modules for its AZtec Microanalysis System at M&M 2013. The new modules enable Large Area Mapping, the use of multiple X-MaxN SDD...

From Oxford Instruments NanoAnalysis 6 Aug 2013

XMC to License Spansion's Floating Gate NOR Flash Technology

Spansion Inc., a global leader in Flash memory-based embedded systems solutions, and XMC, China's fastest growing 300mm semiconductor foundry, today announced an agreement for XMC to license Spansion's floating gate NOR Flash technology. The agreement expands the companies' 300mm manufacturing partnership of Spansion's proprietary 65nm, 45nm and 32nm MirrorBit® Flash memory technology.

3 Aug 2013

Sidense Introduces SHF OTP Memory for ICs Developed in 40nm, 28nm and 20nm Geometries

Sidense Corp., a leading developer of Logic Non-Volatile Memory (LNVM) OTP IP cores, today announced its SHF (Sidense Hiper Fuse) one-time programmable (OTP) memory for ICs developed in advanced processes at 40nm, 28nm, 20nm and smaller geometries. Sidense SHF 1T-OTP has already been qualified in 40nm processes in both G and LP variants, and is completing qualification in multiple 28nm processes with 20nm qualification to follow.

2 Aug 2013

Scientists Create Fully Controllable, Self-Integrating Nanowires for Producing Nanoelectronic Components

Researchers working with tiny components in nanoelectronics face a challenge similar to that of parents of small children: teaching them to manage on their own. The nano-components are so small that arranging them with external tools is impossible. The only solution is to create conditions in which they can be “trusted” to assemble themselves.

1 Aug 2013

Nanotronics Ship nSPEC Wafer Inspection Tool to Kyma Technologies

In May of 2013, Nanotronics Imaging installed an nSPEC® at Kyma Technologies in Raleigh, North Carolina. The companies have quickly established a collaborative partnership after initially meeting in early 2013.

From Nanotronics Imaging 29 Jul 2013

Algo-Logic Systems Introduces 3rd Generation TCP Endpoint with Nanosecond Ultra-Low-Latency

Algo-Logic Systems, a recognized leader in providing hardware-accelerated, deterministic, ultra-low-latency products, systems and solutions for accelerated finance, packet processing and embedded system industries, today announced availability of their new 3rd Generation TCP Endpoint.

26 Jul 2013

Nanoelectronics News

STATS ChipPAC Partners with NTU to Develop Next Generation Semiconductor Packaging Technologies

GreenCentre Canada Incorporates Precision Molecular Design Corporation

OmniVision Deploys ProPlus’ NanoSpice for Simulation of Analog Designs in CMOS Imaging Ics

WITec's RayShield Coupler Offers Raman Data at Low Wavenumbers

Oxford Instruments Launches Four New Modules for its AZtec Microanalysis System at M&M 2013

XMC to License Spansion's Floating Gate NOR Flash Technology

Sidense Introduces SHF OTP Memory for ICs Developed in 40nm, 28nm and 20nm Geometries

Scientists Create Fully Controllable, Self-Integrating Nanowires for Producing Nanoelectronic Components

Nanotronics Ship nSPEC Wafer Inspection Tool to Kyma Technologies

Algo-Logic Systems Introduces 3rd Generation TCP Endpoint with Nanosecond Ultra-Low-Latency

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Enhancing Material Properties through Nanotube Encapsulation

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

Sponsored Content

Characterization of Active Pharmaceutical Ingredients, Injectables, and Proteins

The Future of Wound Care: Why Nanofibers are Key to Accelerated Healing

The Evolution of Lipid Nanoparticles

How Emulsion Electrospinning is Transforming Materials