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Jordan Valley Obtained Repeat Order for ThinFilm Metrology System from Asian Foundry

Jordan Valley, a leading supplier of X-ray based in-line metrology systems for advanced semiconductor manufacturers, today announced that it received repeat order for its new JVX7300HR front-end-of-line strain & thin films metrology system from a leading foundry in Asia.

9 Jul 2013

Solid State Equipment Unveils WaferStorm and WaferEtch Platforms at SEMICON West 2013

Today at SEMICON West, Solid State Equipment LLC (DBA SSEC), a leading provider of single wafer wet processing systems used in the manufacture of semiconductor devices, high-brightness LEDs, and hard disc drives, announced the introduction of its WaferEtch and WaferStorm product lines.

9 Jul 2013

KLA-Tencor Announces 2910 Series Optical Wafer Defect Inspection Platform with NanoPoint Technology

Today KLA-Tencor Corporation announced the new 2910 Series optical wafer defect inspection platform with NanoPoint™ technology and the new eDR™-7100 electron-beam wafer defect review system.

9 Jul 2013

Dow Corning and imec Collaborate for Advance Integration of 3D IC Semiconductor Packaging

Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced today at SEMICON West 2013 that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics.

9 Jul 2013

Applied Materials Introduces NMOS Transistor Application for Applied Centura RP Epi System

Applied Materials, Inc. is extending its decade-long leadership in epitaxial (epi) technology with a newly developed NMOS transistor application for its Applied Centura® RP Epi system.

9 Jul 2013

Dow Corning Joins imec Nanoelectronics Research Center to Work on 3D Semiconductor PAckaging Technology

Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced today that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics. The announcement signals expanded opportunities for both organizations to combine their expertise toward the development and broader adoption of 3D integrated circuit (IC) packaging technologies, wherein IC chips are stacked in vertical 3D architectures.

From IMEC 8 Jul 2013

Researchers Successfully Create Perfect One-Dimensional Molecular Wires

Researchers of MESA+, the research institute for nanotechnology of the University of Twente, in cooperation with researchers of the University of Strasbourg and Eindhoven University of Technology, are the first to successfully create perfect one-dimensional molecular wires of which the electrical conductivity can almost entirely be suppressed by a weak magnetic field at room temperature.

5 Jul 2013

Researchers Discover Graphene has Heat-Dissipating Effect on Silicon-Based Electronics

A layer of graphene can reduce the working temperature in hotspots inside a processor by up to 25 percent – which can significantly extend the working life of computers and other electronics. An international group of researchers, headed by Chalmers University of Technology in Sweden, are the first in the world to show that graphene has a heat dissipating effect on silicon based electronics.

4 Jul 2013

Research and Markets Adds Printed, Organic and Flexible Electronics Report to its Offering

Research and Markets has announced the addition of the "Introduction to Printed, Organic and Flexible Electronics" report to their offering.

4 Jul 2013

Jordan Valley Ships JVSensus System to Asian Foundry for Sub 20nm Node Process Control

Jordan Valley, a leading supplier of X-ray based in-line metrology and defect detection systems for advanced semiconductor manufacturing lines, announced today that it shipped a JVSensus™ system to a leading Asian semiconductor foundry manufacturer, who have adopted the tool as part of its process.

4 Jul 2013

Nanoelectronics News

Jordan Valley Obtained Repeat Order for ThinFilm Metrology System from Asian Foundry

Solid State Equipment Unveils WaferStorm and WaferEtch Platforms at SEMICON West 2013

KLA-Tencor Announces 2910 Series Optical Wafer Defect Inspection Platform with NanoPoint Technology

Dow Corning and imec Collaborate for Advance Integration of 3D IC Semiconductor Packaging

Applied Materials Introduces NMOS Transistor Application for Applied Centura RP Epi System

Dow Corning Joins imec Nanoelectronics Research Center to Work on 3D Semiconductor PAckaging Technology

Researchers Successfully Create Perfect One-Dimensional Molecular Wires

Researchers Discover Graphene has Heat-Dissipating Effect on Silicon-Based Electronics

Research and Markets Adds Printed, Organic and Flexible Electronics Report to its Offering

Jordan Valley Ships JVSensus System to Asian Foundry for Sub 20nm Node Process Control

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Enhancing Material Properties through Nanotube Encapsulation

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

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