Nanoelectronics News

RSS

New Report Tracks Five Main Functionalities of Flexible & Printed Electronics Market

Reportlinker.com announces that a new market research report is available in its catalogue:

29 Jun 2013

Entegris and SEMI Partner to Discuss Nanodefectivity in Semiconductor Manufacturing at SEMICON West 2013

Entegris, Inc. and SEMI® are collaborating to organize a breakfast forum and panel discussion on achieving "Defect Reduction in the Sub-20 nm Era" for semiconductor manufacturing at the upcoming SEMICON West 2013 tradeshow. The forum will be held on Thursday, July 11, 2013 from 7:30 am to 10 am at the San Francisco Marriott Marquis in San Francisco, California.

28 Jun 2013

Linde Electronics Launch Carbon Nanotube Ink for Next Generation Electronics

Linde Electronics, the global electronics business of The Linde Group, today launches a revolutionary new carbon nanotube ink to drive innovation in the development of next generation displays, sensors and other electron...

From Linde 28 Jun 2013

H2W Launches Four Axis Positioning Gantry for High Vacuum Wafer Processing Applications

H2W introduces a fully vacuum compatible four axis (XYθZ) positioning gantry.

From H2W Technologies 28 Jun 2013

New Analog/Mixed-Signal Reference Kit from X-FAB

Gets closer to first-time-right analog design by integrating advanced EDA features in design flow to increase design productivity, reduce time to market and design costs

27 Jun 2013

Market Forecast Report on Printed Electronics

Research and Markets has announced the addition of the "Printed Electronics Version 3.0: A Market Forecast" report to their offering.

From Research and Markets 27 Jun 2013

Synopsys Partners with UMC to Develop 14-nm FinFET Process

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, and United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced that the collaboration between the two companies has resulted in the successful tapeout of UMC's first process qualification vehicle in its 14-nanometer (nm) FinFET process utilizing Synopsys' DesignWare® Logic Library IP portfolio and StarRC™ parasitic extraction solution, a part of the Galaxy™ Implementation Platform.

From Synopsys, Inc. 26 Jun 2013

Vishay Debuts Moisture-Resistant Tantalum Nitride Resistive Film Technology Based QPL Resistors

Vishay Intertechnology, Inc. today launched a new series of QPL MIL-PRF-55342-qualified surface-mount chip resistors that provides established reliability with an “R” level failure rate of 0.01 % per 1000 hours.

24 Jun 2013

High Drive Current Achieved on Tungsten Diselenide Monolayer Transistor

Researchers at UC Santa Barbara, in collaboration with University of Notre Dame, have recently demonstrated the highest reported drive current on a transistor made of a monolayer of tungsten diselenide (WSe2), a 2-dimensional atomic crystal categorized as a transition metal dichalcogenide (TMD).

24 Jun 2013

Major Foundry Acquires Mattson’s Helios XP Systems for 2Xnm Production

Mattson Technology Inc., a leading supplier of advanced process equipment used for the manufacture of semiconductors, today announced that it has shipped multiple systems of its Helios® XP rapid thermal processing (RTP) system for use in mass production at a major foundry. The systems will support the foundry's 2Xnm capacity ramp by offering leading temperature control for reliable device manufacturing coupled with a low cost of ownership (CoO).

21 Jun 2013