Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, and United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced that the collaboration between the two companies has resulted in the successful tapeout of UMC's first process qualification vehicle in its 14-nanometer (nm) FinFET process utilizing Synopsys' DesignWare® Logic Library IP portfolio and StarRC™ parasitic extraction solution, a part of the Galaxy™ Implementation Platform.
Vishay Intertechnology, Inc. today launched a new series of QPL MIL-PRF-55342-qualified surface-mount chip resistors that provides established reliability with an “R” level failure rate of 0.01 % per 1000 hours.
Researchers at UC Santa Barbara, in collaboration with University of Notre Dame, have recently demonstrated the highest reported drive current on a transistor made of a monolayer of tungsten diselenide (WSe2), a 2-dimensional atomic crystal categorized as a transition metal dichalcogenide (TMD).
Mattson Technology Inc., a leading supplier of advanced process equipment used for the manufacture of semiconductors, today announced that it has shipped multiple systems of its Helios® XP rapid thermal processing (RTP) system for use in mass production at a major foundry. The systems will support the foundry's 2Xnm capacity ramp by offering leading temperature control for reliable device manufacturing coupled with a low cost of ownership (CoO).
Underscoring the strategic blueprint of Governor Andrew M. Cuomo in fueling New York’s growing reputation as a hub for nanotechnology-enabled innovation, SUNY’s College of Nanoscale Science and Engineering (CNSE) and Pittsfield, Massachusetts-based Nuclea Biotechnologies, Inc. (Nuclea) today announced the launch of a $1 million research partnership to enable the development and commercialization of a high-throughput nanochip to accelerate the diagnosis and treatment of breast, colon, prostate and other cancers.
CEA-Leti will host a workshop at SEMICON West 2013 on major technology developments in the next 10 years.
3D printing can now be used to print lithium-ion microbatteries the size of a grain of sand. The printed microbatteries could supply electricity to tiny devices in fields from medicine to communications, including many that have lingered on lab benches for lack of a battery small enough to fit the device, yet provide enough stored energy to power them.
Camtek Ltd., today announced that it has entered into a frame engagement for 10 semiconductor inspection systems with an Asian OSAT (outsourced semiconductor assembly and test) company. The first systems’ order, in excess of $2 million, will be installed during the second and third quarters, with expectations for additional systems' orders over the next few quarters.
Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that eMemory Technology, a leader in embedded non-volatile memory silicon IP, has selected the company’s Analog FastSPICE (AFS) Platform for block-level characterization, and full-circuit verification of its embedded non-volatile memory products for SoCs in wireless, consumer, industrial, and automotive applications.
GLOBALFOUNDRIES and Fuzhou Rockchip Electronics Co., Ltd. today announced that Rockchip’s next-generation mobile processors are ramping to production on GLOBALFOUNDRIES’ 28nm High-K Metal Gate (HKMG) process technology.
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