Nanoelectronics News

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Synopsys Introduces High Performance Core Design Kit for Optimization of SoC IP Cores

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced an extension to its DesignWare® Duet Embedded Memory and Logic Library IP portfolio specifically designed to enable the optimized implementation of a broad range of processor cores.

From Synopsys, Inc. 13 Jun 2013

Novel Nanoscale Thermometer to Study Heat Dissipation in Molecular-Scale Circuits

In findings that could help overcome a major technological hurdle in the road toward smaller and more powerful electronics, an international research team involving University of Michigan engineering researchers, has shown the unique ways in which heat dissipates at the tiniest scales.

13 Jun 2013

Imec Highlights New Insights into 3D FinFETs at VLSI 2013 Symposium

At this week’s VLSI 2013 Symposium in Kyoto, Japan, imec highlighted new insights into 3D fin shaped field effect transistors (FinFETs) and high mobility channels scaling for the 7nm and 5nm technology node.

From IMEC 13 Jun 2013

eMemory's Embedded Non-Volatile Memory Technologies to be Integrated into UMC's 28nm Process

eMemory, an embedded non-volatile memory (eNVM) industry leader and United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced an expanded technology cooperation to integrate eMemory's one-time-programmable (OTP) and multiple-time-programmable (MTP) embedded non-volatile memory technologies into UMC's 28nm process.

12 Jun 2013

Novel Approach to Grow III-V semiconductor Nanowires without Metal Catalysts or Nano-Patterning

The research team demonstrated a novel method to epitaxially synthesize structurally and compositionally homogeneous and spatially uniform ternary InAsyP1-y nanowire on Si at wafer-scale using metal-organic chemical vapor deposition (MOCVD).

11 Jun 2013

New Approach to Control Growth of Uniform Atomic Layers of MDS

Scientists at Rice University and Oak Ridge National Laboratory (ORNL) have advanced on the goal of two-dimensional electronics with a method to control the growth of uniform atomic layers of molybdenum disulfide (MDS).

From Oak Ridge National Laboratory 11 Jun 2013

Researchers at CEA-Leti Win the Avantex Innovation Prize for Application of E-Thread Technology

CEA-Leti announced today that researchers Dominique Vicard and Jean Brun received the Avantex Innovation Prize for the use of the E-Thread® technology in textiles.

From CEA-Leti 10 Jun 2013

Texas Instruments to Expand Chengdu Wafer Fabrication Factory

Texas Instruments Incorporated (TI) today outlined its long-term strategy for manufacturing facilities in Chengdu, China. Future plans include a new assembly/test operation and the expansion of its existing wafer fabrication factory.

10 Jun 2013

Bio-Integrated Electronic Tattoo Measures Vital Signs and Muscle Movement

In the not-so-distant future, patients with heart disease won’t have to strap brick-size Holter monitors to their arms or waists, with webs of electrodes connected to their chests to monitor their hearts. Those unable to speak will communicate by muscle movements in their throats, and the blind will read with finger tubes that “poke” their fingertips with programmable electrotactile stimulations in place of bulky brail.

10 Jun 2013

SilabTech Achieves First Silicon Success for Latest 28nm High-Speed, Mixed-Signal PHY Ips

Mentor Graphics Corp. today announced that SilabTech Pvt. Ltd. has achieved first silicon success for their latest 28nm high-speed, mixed-signal PHY IPs for PCI Express, SATA, MIPI, M-PHY and USB 3.0 in advance of the planned schedule.

10 Jun 2013

Nanoelectronics News

Synopsys Introduces High Performance Core Design Kit for Optimization of SoC IP Cores

Novel Nanoscale Thermometer to Study Heat Dissipation in Molecular-Scale Circuits

Imec Highlights New Insights into 3D FinFETs at VLSI 2013 Symposium

eMemory's Embedded Non-Volatile Memory Technologies to be Integrated into UMC's 28nm Process

Novel Approach to Grow III-V semiconductor Nanowires without Metal Catalysts or Nano-Patterning

New Approach to Control Growth of Uniform Atomic Layers of MDS

Researchers at CEA-Leti Win the Avantex Innovation Prize for Application of E-Thread Technology

Texas Instruments to Expand Chengdu Wafer Fabrication Factory

Bio-Integrated Electronic Tattoo Measures Vital Signs and Muscle Movement

SilabTech Achieves First Silicon Success for Latest 28nm High-Speed, Mixed-Signal PHY Ips

Gold Nanoparticles to Restore Vision in Retinal Disorders

Levidian and Zentek Seek to Establish Graphene-Integrated Filter Manufacturing Facility in the Middle East to Advance Cleaner, Safer Air

Biochar-Modified Titanium Dioxide Nanocomposites for Enhanced Water Treatment

New Nanocage Material Removes Up to 90% of Toxic PFAS from Water

Enhancing Chitosan Films with Silanized Hexagonal Boron Nitride for Sustainable Applications

Overcoming Nanogold Production Challenges

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

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