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Printed Electronics Test Center Network Adds Three More Laboratories

Xenon Corporation, the world leader in pulsed light technology, today announced that three new laboratories have joined the Printed Electronics Test Center Network, bringing the total of participating labs to 25 worldwide. "This is another indication that PE is rapidly becoming a commercial industry, driven by efforts like those of the Test Center Network," said Lou Panico, CEO of Xenon.

From Xenon Corporation 6 Jun 2013

PerkinElmer, Inc Launches App Version of ChemDraw and Chem3D - available in the App Store

PerkinElmer, Inc., a global leader focused on improving the health and safety of people and the environment, has announced the availability on the App Store of the ChemDraw® and Chem3D® apps. With over a million...

From PerkinElmer Inc. 4 Jun 2013

SMIC, BIDIMC and ZDG Partner to Establish Wafer Manufacturing Facility

Semiconductor Manufacturing International Corporation ("SMIC";), mainland China's largest and most advanced semiconductor foundry, today announced that it entered into the Joint Venture Agreement with SMIC Beijing, BIDIMC and ZDG in relation to the establishment of the Joint Venture Company (subject to the approval of the relevant PRC authorities).

From Semiconductor Manufacturing International Corporation (SMIC) 4 Jun 2013

Comprehensive Design Implementation Solution for Samsung 14LPE FinFET Process from Synopsys

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the availability of a comprehensive design implementation solution for the Samsung 14LPE FinFET process.

From Synopsys, Inc. 4 Jun 2013

Fluid-Enhanced Crystal Engineering Printing Process Improves Organic Electronics

Through innovations to a printing process, researchers have made major improvements to organic electronics—a technology in demand for lightweight, low-cost solar cells, flexible electronic displays and tiny sensors. The printing method is fast and works with a variety of organic materials to produce semiconductors of strikingly higher quality than what has so far been achieved with similar methods.

4 Jun 2013

GLOBALFOUNDRIES to Combine ARM’s New Mobile Processors with 28nm-SLP HKMG Process Technology

In conjunction with the launch of the ARM® Cortex®-A12 processor, ARM and GLOBALFOUNDRIES today announced new power, performance and cost-optimized POP™ technology offerings for the ARM Cortex-A12 and Cortex-A7 processors for GLOBALFOUNDRIES 28nm-SLP High-K Metal Gate (HKMG) process technology. The Cortex-A12 processor was introduced by ARM today as part of a suite of IP targeting the rapidly growing market for mid-range mobile devices.

From GlobalFoundries 3 Jun 2013

Aehr Test Systems Secures Major Production Order for Multiple FOX Semiconductor Test Systems

Aehr Test Systems, a worldwide supplier of semiconductor test and burn-in equipment, announced today that it has received an order totaling nearly $2 million, with a 30% down payment, for multiple production systems of its next-generation FOX Semiconductor Test System from a leading manufacturer of flash memory devices. The systems are expected to ship in the first half of calendar 2014.

3 Jun 2013

Samsung and Mentor Graphics Improve Calibre Design Kits for 14nm IC Manufacturing Processes

Mentor Graphics Corp. today announced that Calibre® nmDRC™ and Calibre nmLVS rule decks for Samsung’s 14nm IC manufacturing processes have been significantly improved since first release. For example, the joint efforts have resulted in a 50% better performance over the previous release for the Calibre nmDRC design kit.

3 Jun 2013

TSMC Implements Analog FastSPICE Mega Silicon-Accurate Circuit Simulator for Memory IP Verification

Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that TSMC is using Analog FastSPICE Mega (AFS Mega™) for memory IP verification. Memory IP circuits implemented in 16-nm and smaller FinFET-based process nodes must meet stringent performance targets while requiring six-sigma bit cell yield to meet cost and power targets.

1 Jun 2013

Berkeley Design Automation Introduces AFS Mega Silicon-Accurate Circuit Simulator for Memories

Berkeley Design Automation, Inc., provider of nanometer circuit verification, today announced the availability of the Analog FastSPICE Mega (AFS Mega™) silicon-accurate circuit simulator for memories and other mega-scale array-based circuits such as CMOS image sensors.

31 May 2013

Nanoelectronics News

Printed Electronics Test Center Network Adds Three More Laboratories

PerkinElmer, Inc Launches App Version of ChemDraw and Chem3D - available in the App Store

SMIC, BIDIMC and ZDG Partner to Establish Wafer Manufacturing Facility

Comprehensive Design Implementation Solution for Samsung 14LPE FinFET Process from Synopsys

Fluid-Enhanced Crystal Engineering Printing Process Improves Organic Electronics

GLOBALFOUNDRIES to Combine ARM’s New Mobile Processors with 28nm-SLP HKMG Process Technology

Aehr Test Systems Secures Major Production Order for Multiple FOX Semiconductor Test Systems

Samsung and Mentor Graphics Improve Calibre Design Kits for 14nm IC Manufacturing Processes

TSMC Implements Analog FastSPICE Mega Silicon-Accurate Circuit Simulator for Memory IP Verification

Berkeley Design Automation Introduces AFS Mega Silicon-Accurate Circuit Simulator for Memories

Gold Nanoparticles to Restore Vision in Retinal Disorders

Levidian and Zentek Seek to Establish Graphene-Integrated Filter Manufacturing Facility in the Middle East to Advance Cleaner, Safer Air

Biochar-Modified Titanium Dioxide Nanocomposites for Enhanced Water Treatment

New Nanocage Material Removes Up to 90% of Toxic PFAS from Water

Enhancing Chitosan Films with Silanized Hexagonal Boron Nitride for Sustainable Applications

Overcoming Nanogold Production Challenges

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

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