Nanoelectronics News

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Semiconductor Packaging and Test Services Provider, STATS ChipPAC, Opens New Building in Singapore

STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" ), a leading provider of advanced semiconductor packaging and test services, today celebrated the grand opening of its new building in Singapore with more than 150 distinguished guests, including Singapore Deputy Prime Minister and Coordinating Minister for National Security & Minister for Home Affairs, Mr. Teo Chee Hean, and other governmental and business representatives.

30 May 2013

Dyesol’s Solar-Enabling Technology Exceeds Key International PV Industry Standard Test

Australian “clean-tech” company and Dye Solar Cell industry leader, Dyesol Limited, today announced its solar-enabling technology has exceeded a key international photovoltaic industry standard test for long-term durability by 400 per cent.

30 May 2013

TSMCfs 16-nm FinFET Process Used to Create High Performance FPGAs

Xilinx Inc. and TSMC announced that they are teaming together to create the fastest time-to-market and highest performance FPGAs to be built on TSMCfs 16-nanometer FinFET i16FinFETj process, a program Xilinx calls eFinFast.f

From TSMC Taiwan Semiconductor Manufacturing Company 29 May 2013

New Forecast Report on Global Metal Organic Chemical Vapor Deposition Market

Research and Markets has announced the addition of the "Global Metal Organic Chemical Vapor Deposition Market 2012-2016" report to their offering.

From Research and Markets 29 May 2013

New Report Sheds Light on Global Market for Supercapacitors

Reportlinker.com announces that a new market research report is available in its catalogue: Supercapacitors: World Markets, Technologies & Opportunities: 2013-2018

28 May 2013

Mentor Graphics Collaborates with Lumerical Solutions and OpSIS to Develop PDK for Silicon Photonics Process

Mentor Graphics Corp., a leader in electronic design automation, today announced it has teamed with OpSIS and Lumerical Solutions to develop a complete EDA-style, full flow process design kit (PDK) for the OpSIS IME (Institute of Microelectronics) silicon photonics process.

24 May 2013

United Microelectronics Sets up Center of Excellence for Specialty Technologies at Singapore

United Microelectronics Corporation ("UMC"), today announced that the company has established Fab 12i in Singapore as its "Center of Excellence" to spearhead the company's R&D and manufacturing for advanced specialty process technologies.

From United Microelectronics Corporation 24 May 2013

Axcelis Delivers Novel Purion Platform for Sub-16 nm Devices to Asian Semiconductor Manufacturer

Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced today that it has shipped the new Purion M medium current implanter, to a major semiconductor manufacturer located in Asia.

24 May 2013

Toshiba Develops 19 nm Process for Mass Production of 2-bit-per-cell 64 Gigabit NAND Memory Chips

Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced that the company has developed second generation 19 nanometer process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month.

22 May 2013

Xilinx 28 nm Devices Clear Rigorous Protocol, Electrical and Interoperability Tests at PCI-SIG Event

Xilinx, Inc. today announced that its All Programmable 7 series FPGAs and Zynq®-7000 All Programmable SoCs have achieved full PCI Express® compliance and are now listed on the PCI-SIG integrator's list.

21 May 2013

Nanoelectronics News

Semiconductor Packaging and Test Services Provider, STATS ChipPAC, Opens New Building in Singapore

Dyesol’s Solar-Enabling Technology Exceeds Key International PV Industry Standard Test

TSMCfs 16-nm FinFET Process Used to Create High Performance FPGAs

New Forecast Report on Global Metal Organic Chemical Vapor Deposition Market

New Report Sheds Light on Global Market for Supercapacitors

Mentor Graphics Collaborates with Lumerical Solutions and OpSIS to Develop PDK for Silicon Photonics Process

United Microelectronics Sets up Center of Excellence for Specialty Technologies at Singapore

Axcelis Delivers Novel Purion Platform for Sub-16 nm Devices to Asian Semiconductor Manufacturer

Toshiba Develops 19 nm Process for Mass Production of 2-bit-per-cell 64 Gigabit NAND Memory Chips

Xilinx 28 nm Devices Clear Rigorous Protocol, Electrical and Interoperability Tests at PCI-SIG Event

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Enhancing Material Properties through Nanotube Encapsulation

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

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Characterization of Active Pharmaceutical Ingredients, Injectables, and Proteins

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The Evolution of Lipid Nanoparticles

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