Nanoelectronics News

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Nanometer-Node Wafer Process Developers Seek Integration of Advanced Slurry Metrology Tools

Vantage Technology today announced that major IC production facilities are seeking more slurry analysis data during wafer processing to correlate large particle counts (LPCs) with damaging wafer scratches.

12 Apr 2013

University of Dayton to Establish New Center of Excellence in Thin-Film Research and Surface Engineering

CETRASE researchers will focus on energy systems such as fuel and solar cells and batteries, electronics, optics, communication and sensor devices. These systems are found in medical devices and advanced medical imaging,...

12 Apr 2013

Researchers Develop Ultrathin, Flexible Optoelectronic Devices

Researchers at the University of Illinois at Urbana-Champaign and Washington University in St. Louis developed ultrathin, flexible optoelectronic devices – including LEDs the size of individual neurons – that are lighting the way for neuroscientists in the field of optogenetics and beyond.

12 Apr 2013

Samsung Begins Mass Production of 128-Gigabit 3-Bit MLC NAND Flash Using 10nm Process

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing a 128-gigabit (Gb), 3-bit multi-level-cell (MLC) NAND memory chip using 10 nanometer (nm)-class process technology this month. The highly advanced chip will enable high-density memory solutions such as embedded NAND storage and solid state drives (SSDs).

From Samsung Electronics 12 Apr 2013

Chemist Bozhi Tian to Explore Neurodegenerative Disease Using Nanoelectronic Devices

Bozhi Tian, assistant professor in chemistry, has been named a 2013 Searle Scholar and will receive $300,000 to support his research over the next three years.

12 Apr 2013

AMEC’s Primo SSC AD-RIE Etcher Qualified for Critical Flash Applications at 20nm and Below

Advanced Micro-Fabrication Equipment Inc. (AMEC) said today that it has developed a Single-Station Chamber Advanced Dielectric Etcher (Primo SSC AD-RIE™) capable of processing the most rigorous semiconductor applications.

11 Apr 2013

ESI Strengthens Laser-Based Wafer Processing Capabilities Through GSI Semiconductor Systems Business Acquisition

Electro Scientific Industries, Inc., a leading supplier of innovative laser-based manufacturing solutions for smart consumer electronics and other microtechnology industries, today announced it had signed a definitive agreement to acquire the Semiconductor Systems business of GSI Group, Inc., a global leader and supplier of precision photonics, laser-based solutions and precision motion devices to the medical, industrial, scientific, and electronics markets.

From Electro Scientific Industries (ESI) 11 Apr 2013

Winbond Electronics Increases Production of 58-nm Multi-I/O SpiFlash Memories

Winbond Electronics Corporation, a global supplier of Flash memories and inventor of the popular Multi-I/O Serial Flash architecture, today announced it is now the top supplier of Serial NOR Flash memories worldwide.

11 Apr 2013

Fujitsu Semiconductor Mass Produces 2G/3G/4G Baseband Processors Using Synopsysf 28-nm MIPI M-PHY

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that Fujitsu Semiconductor Limited is successfully shipping a 2G/3G/4G baseband processor using Synopsys' DesignWare DigRFv4 M-PHY and DigRF 3G PHY IP.

From Synopsys, Inc. 10 Apr 2013

Oxford Instruments Continues Chinese Seminar Series on Nanoscale Plasma Processing

Continuing on from the success of their previous program of Chinese Seminars which have attracted over 200 participants, Oxford Instruments, leaders in the manufacture of plasma etch and deposition systems, will be holding two additional one day Seminars in Asia focussing on Nanoscale Plasma Processing.

From Oxford Instruments Plasma Technology 10 Apr 2013

Nanoelectronics News

Nanometer-Node Wafer Process Developers Seek Integration of Advanced Slurry Metrology Tools

University of Dayton to Establish New Center of Excellence in Thin-Film Research and Surface Engineering

Researchers Develop Ultrathin, Flexible Optoelectronic Devices

Samsung Begins Mass Production of 128-Gigabit 3-Bit MLC NAND Flash Using 10nm Process

Chemist Bozhi Tian to Explore Neurodegenerative Disease Using Nanoelectronic Devices

AMEC’s Primo SSC AD-RIE Etcher Qualified for Critical Flash Applications at 20nm and Below

ESI Strengthens Laser-Based Wafer Processing Capabilities Through GSI Semiconductor Systems Business Acquisition

Winbond Electronics Increases Production of 58-nm Multi-I/O SpiFlash Memories

Fujitsu Semiconductor Mass Produces 2G/3G/4G Baseband Processors Using Synopsysf 28-nm MIPI M-PHY

Oxford Instruments Continues Chinese Seminar Series on Nanoscale Plasma Processing

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Enhancing Material Properties through Nanotube Encapsulation

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

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