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AMEC’s Primo SSC AD-RIE Etcher Qualified for Critical Flash Applications at 20nm and Below

AMEC’s Primo SSC AD-RIE Etcher Qualified for Critical Flash Applications at 20nm and Below

11 Apr 2013
ESI Strengthens Laser-Based Wafer Processing Capabilities Through GSI Semiconductor Systems Business Acquisition

ESI Strengthens Laser-Based Wafer Processing Capabilities Through GSI Semiconductor Systems Business Acquisition

From Electro Scientific Industries (ESI) 11 Apr 2013
Winbond Electronics Increases Production of 58-nm Multi-I/O SpiFlash Memories

Winbond Electronics Increases Production of 58-nm Multi-I/O SpiFlash Memories

11 Apr 2013
Fujitsu Semiconductor Mass Produces 2G/3G/4G Baseband Processors Using Synopsysf 28-nm MIPI M-PHY

Fujitsu Semiconductor Mass Produces 2G/3G/4G Baseband Processors Using Synopsysf 28-nm MIPI M-PHY

From Synopsys, Inc. 10 Apr 2013
Oxford Instruments Continues Chinese Seminar Series on Nanoscale Plasma Processing

Oxford Instruments Continues Chinese Seminar Series on Nanoscale Plasma Processing

From Oxford Instruments Plasma Technology 10 Apr 2013
Penn State Teams Up with Dow Chemical to Advance Flexible Electronics

Penn State Teams Up with Dow Chemical to Advance Flexible Electronics

From Dow Chemical Company 9 Apr 2013
Flexible Electronics Show Promise to Advance Many Applications

Flexible Electronics Show Promise to Advance Many Applications

9 Apr 2013
TSMC, Cadence to Develop Design Infrastructure for 16-nm FinFET Technology

TSMC, Cadence to Develop Design Infrastructure for 16-nm FinFET Technology

From Cadence Design Systems 9 Apr 2013
Top European R&D Organizations Place Order for SPTS Technologies’ Etch Solutions

Top European R&D Organizations Place Order for SPTS Technologies’ Etch Solutions

5 Apr 2013
ARM Cortex-A57 Processor to be Implemented on TSMC's 16-nm FinFET Process

ARM Cortex-A57 Processor to be Implemented on TSMC's 16-nm FinFET Process

From Cadence Design Systems 5 Apr 2013

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