Nanoelectronics News

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Researchers Test Nanometer-Scale Esaki Tunnel Diodes for Extending Battery Life

Researchers at Rochester Institute of Technology, international semiconductor consortium SEMATECH and Texas State University have demonstrated that use of new methods and materials for building integrated circuits can reduce power—extending battery life to 10 times longer for mobile applications compared to conventional transistors.

31 Jan 2013

Kilopass Completes JEDEC 3-Lot Qualification for SMIC LL CMOS Process Technologies

Kilopass Technology, Inc., the leading provider of semiconductor logic non-volatile memory (NVM) intellectual property (IP), and Semiconductor Manufacturing International Corporation (NYSE: SMI) (SEHK: 981), a leading IC foundry, today announced that Kilopass IP has successfully completed the JEDEC 3-lot qualification for the SMIC 65nm, 55nm and 40nm low-leakage (LL) CMOS process technologies.

31 Jan 2013

SEMI and USPVMC Partner to Enhance Standards for Solar Thin Film Industry

SEMI and the U.S. Photovoltaic Manufacturing Consortium (PVMC) today announced the signing of a Memorandum of Understanding (MOU) to enhance their cooperation in areas of standards and roadmap activities for the solar thin film industry.

From College of Nanoscale Science and Engineering, University at Albany 30 Jan 2013

SWeNT to Display CNT Inks at Flexible Electronics and Displays Conference

SouthWest NanoTechnologies, Inc. (SWeNT®), the world leader in high quality, Single-Wall and Specialty Multi-Wall (SMW™) carbon nanotubes (CNT), will display its family of conductive and semi-conducting CNT inks for flexible printed electronics at the FlexTech Alliance 2013 Flexible Electronics and Displays Conference and Exhibition. SWeNT will be exhibiting in booth 48, Jan. 30th to Feb. 1st at the Phoenix Convention Center in Phoenix, AZ.

30 Jan 2013

TSMC OIP Forum 2012 Honors Berkeley Design Automation and Silicon Creations with Customers’ Choice Award

Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that its joint paper with Silicon Creations, “Silicon-Accurate Mixed-Signal Fractional-N PLL IP Design,” presented at TSMC’s 2012 Open Innovation Platform® (OIP) Ecosystem Forum has received the TSMC OIP Forum 2012 Customers’ Choice Award.

30 Jan 2013

STATS ChipPAC and UMC Demonstrate TSV-Enabled 3D IC Chip Stacking Technology

STATS ChipPAC Ltd., a leading semiconductor advanced packaging and test service provider, and United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced the world's first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem collaboration.

From United Microelectronics Corporation 30 Jan 2013

Synopsys Introduces 28-nm 10G PHY IP Multiprotocol for Energy Efficient Networking Applications

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the availability of its multiprotocol DesignWare® Enterprise 10G PHY IP to address the connectivity needs of a broad range of high-end, energy efficient networking and computing applications.

From Synopsys, Inc. 30 Jan 2013

Qualcomm, Imec Announce Extended Collaboration Deal to Advance CMOS Technologies

Nanoelectronics research centre imec and Qualcomm Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated, announced today an extended collaboration agreement to accelerate scaling technologies for logic and memory devices. The first fabless integrated circuit company to become a core partner of imec, Qualcomm Technologies will gain comprehensive insight into all advanced process technologies under investigation at imec to help shape future product roadmaps.

From IMEC 29 Jan 2013

ProPlus Design Systems Launches Wafer-Level, 1/f Noise Measurement System

ProPlus Design Solutions, Inc., the global leader for SPICE modeling solutions and the leading technology provider for design for yield (DFY) applications, today announced it is shipping 9812D, the latest generation wafer-level, 1/f noise measurement system, to select customers.

25 Jan 2013

ASU Student-Built Infrared Camera to Fly on Nanosatellite

Michael Veto, a third-year graduate student in the School of Earth and Space Exploration (SESE) at Arizona State University, has been chosen to build an infrared and visible light camera system that will launch on a space satellite. Veto, who earned his undergraduate degree in aerospace engineering at ASU, is a geology doctoral student of Philip Christensen, Regents' Professor of Geological Sciences in ASU's College of Liberal Arts and Sciences.

From Arizona State University 25 Jan 2013

Nanoelectronics News

Researchers Test Nanometer-Scale Esaki Tunnel Diodes for Extending Battery Life

Kilopass Completes JEDEC 3-Lot Qualification for SMIC LL CMOS Process Technologies

SEMI and USPVMC Partner to Enhance Standards for Solar Thin Film Industry

SWeNT to Display CNT Inks at Flexible Electronics and Displays Conference

TSMC OIP Forum 2012 Honors Berkeley Design Automation and Silicon Creations with Customers’ Choice Award

STATS ChipPAC and UMC Demonstrate TSV-Enabled 3D IC Chip Stacking Technology

Synopsys Introduces 28-nm 10G PHY IP Multiprotocol for Energy Efficient Networking Applications

Qualcomm, Imec Announce Extended Collaboration Deal to Advance CMOS Technologies

ProPlus Design Systems Launches Wafer-Level, 1/f Noise Measurement System

ASU Student-Built Infrared Camera to Fly on Nanosatellite

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Enhancing Material Properties through Nanotube Encapsulation

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

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The Evolution of Lipid Nanoparticles

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