Further reinforcing Governor Andrew Cuomo’s innovation-driven strategy to establish New York as the global hub for next-generation nanotechnology research, IBM and the College of Nanoscale Science and Engineering (CNSE) of the University at Albany announced today that CNSE has been selected to join IBM’s “Pre-T0” Joint Development Alliance, which targets the development of advanced nanoelectronics processes and devices to enable applications ranging from laptops and smart phones to home appliances, advanced sensors, and energy-efficient computer servers.
Nanometrics Incorporated, a leading provider of advanced process control metrology and inspection systems, today announced that the company is scheduled to present at the Stifel Nicolaus 2013 Technology Conference. Company representatives include Dr. Timothy Stultz, president and chief executive officer, and Ronald Kisling, chief financial officer.
STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX: S24) today announced implementation of breakthrough performance and packaging innovation in multiple advanced chipsets for the rapidly developing smartphone market in China. Spreadtrum Communications, a leading fabless semiconductor provider in China, has adopted STATS ChipPAC's packaging innovations for a number of its mobile chipsets.
Reportlinker.com announces that a new market research report is available in its catalogue: Wafer Packaging Fabs Database
Cadence Design Systems, Inc., a leader in global electronic design innovation, announced today that Avago Technologies®, a leading supplier of analog interface components, used Cadence® Encounter® Digital Implementation (EDI) System to accelerate the design schedule and boost engineering productivity on a large-scale 28-nanometer networking chip.
Lilliputian Systems, Inc., a developer of portable power products for consumer electronics, announced today that Nectar™, a revolutionary Mobile Power System, has won several prestigious awards at the annual International Consumer Electronics Show (CES) in Las Vegas.
Veeco Instruments Inc. announced today that the Company has received an order for multi- and single-chamber TurboDisc® MOCVD Systems, including the new MaxBright® M™, from KaiStar Lighting Co., Ltd. KaiStar, a joint venture between Epistar Corporation and Shenzhen Kaifa Technology Co., Ltd., is based in Xiamen, China and began LED production in 2012. The systems will be added to KaiStar’s existing fleet of Veeco MOCVD systems as part of their 2013 capacity expansion plan.
The Semiconductor Manufacturing International Corporation (SMIC), headquartered in Shanghai, China, have purchased multiple systems for photomask verification, repair and metrology from Carl Zeiss Semiconductor Metrology Systems (SMS) Division (www.zeiss.com/sms), a leading supplier of both photomask metrology and manufacturing equipment. SMIC will apply the tools as economic solutions for their mask services.
Image sensors are at the core of every digital camera. Before a snapshot appears on the display, the sensors first convert the light from the lens to electrical signals. The image processor then uses these to create the final photo.
A major semiconductor discrete manufacturer has purchased an additional Surface Tension Gradient Dryer (STGD) from MicroTech because of its ability to dry thin wafers without damage to the wafer's thin films. This is the second order to the manufacturer by MicroTech, a Silicon Valley wet process station supplier.
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