Faraday Technology Corporation, a leading ASIC and silicon IP provider, and United Microelectronics Corporation, a leading global semiconductor foundry, today announced that they have produced customer system-on-chip (SoC) ICs with a density of over 300 million gates.
A new HemiPleat® eXtreme nano fiber filter from Camfil Farr Air Pollution Control (APC) offers higher filtration efficiencies, greater durability, and better resistance to pulse-cleaning than competitive products. These advantages can extend filter life and reduce operating and energy costs associated with industrial cartridge dust and fume collectors.
Scientists at CSIRO and RMIT University have produced a new two-dimensional material that could revolutionise the electronics market, making "nano" more than just a marketing term.
At the European 3D TSV Summit in Grenoble, France on January 22-23, 2013, imec, a world-leading nano-electronics research institute, today announced that together with Cadence Design Systems they have developed, implemented and validated an automated 3D Design-for-Test (DFT) solution to test logic-memory interconnects in DRAM-on-logic stacks.
Two teams of researchers from The University of Texas at Dallas have been chosen to help a $194 million national network create the technologies of the next generation.
Researchers at Peking University have succeeded in establishing a scalable technique for the synthesis of high quality graphene p-n junctions, a technological advance that may support the creation of more efficient photo detectors, solar cells and night vision systems.
Three University of California, Riverside scientists and engineers are members of a new national research center — the Center for Spintronic Materials, Interfaces, and Novel Architectures (C-SPIN) — focused on developing the next generation of microelectronics. Led by the University of Minnesota, C-SPIN is being supported by a five-year $28 million grant, about $3 million of which is allocated to UC Riverside.
The National Institute of Advanced Industrial Science and Technology and the National Institute for Materials Science jointly developed a graphene transistor based on a new operating principle.
Extended-reliability versions of Freescale's PC837x PowerQUICC® II Pro communications processor PC8378 and PC8379 are now available from e2v for networking applications in aerospace, defence and demanding outdoor environments.
The total R&D volume engaged in the ENIAC Joint Undertaking (JU) programme reached 1.8B Euro at the end of 2012. 2012 projects sum up to more than 4 times the volume achieved two years before, thanks to ambitious Key Enabling Technologies (KET) Pilot Line projects and enabled by a strong involvement of the ENIAC member States. The budget available for 2013 allows supporting R&D projects approaching 1 B euro total eligible costs.
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