Veeco Instruments Inc. announced today that the Company has received an order for multi- and single-chamber TurboDisc® MOCVD Systems, including the new MaxBright® M™, from KaiStar Lighting Co., Ltd. KaiStar, a joint venture between Epistar Corporation and Shenzhen Kaifa Technology Co., Ltd., is based in Xiamen, China and began LED production in 2012. The systems will be added to KaiStar’s existing fleet of Veeco MOCVD systems as part of their 2013 capacity expansion plan.
The Semiconductor Manufacturing International Corporation (SMIC), headquartered in Shanghai, China, have purchased multiple systems for photomask verification, repair and metrology from Carl Zeiss Semiconductor Metrology Systems (SMS) Division (www.zeiss.com/sms), a leading supplier of both photomask metrology and manufacturing equipment. SMIC will apply the tools as economic solutions for their mask services.
Image sensors are at the core of every digital camera. Before a snapshot appears on the display, the sensors first convert the light from the lens to electrical signals. The image processor then uses these to create the final photo.
A major semiconductor discrete manufacturer has purchased an additional Surface Tension Gradient Dryer (STGD) from MicroTech because of its ability to dry thin wafers without damage to the wafer's thin films. This is the second order to the manufacturer by MicroTech, a Silicon Valley wet process station supplier.
Faraday Technology Corporation, a leading ASIC and silicon IP provider, and United Microelectronics Corporation, a leading global semiconductor foundry, today announced that they have produced customer system-on-chip (SoC) ICs with a density of over 300 million gates.
A new HemiPleat® eXtreme nano fiber filter from Camfil Farr Air Pollution Control (APC) offers higher filtration efficiencies, greater durability, and better resistance to pulse-cleaning than competitive products. These advantages can extend filter life and reduce operating and energy costs associated with industrial cartridge dust and fume collectors.
Scientists at CSIRO and RMIT University have produced a new two-dimensional material that could revolutionise the electronics market, making "nano" more than just a marketing term.
At the European 3D TSV Summit in Grenoble, France on January 22-23, 2013, imec, a world-leading nano-electronics research institute, today announced that together with Cadence Design Systems they have developed, implemented and validated an automated 3D Design-for-Test (DFT) solution to test logic-memory interconnects in DRAM-on-logic stacks.
Two teams of researchers from The University of Texas at Dallas have been chosen to help a $194 million national network create the technologies of the next generation.
Researchers at Peking University have succeeded in establishing a scalable technique for the synthesis of high quality graphene p-n junctions, a technological advance that may support the creation of more efficient photo detectors, solar cells and night vision systems.
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