Nanoelectronics News

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Samsung Invests in Mobile Application Processors Production on 300mm Wafers at 28nm Node

Samsung Austin Semiconductor LLC today announced that a $4 billion investment at its Austin, Texas, site is on schedule for production of state-of-the-art mobile application processors within the second half of 2013.

17 Dec 2012

Nano-Antenna in Light-Sensing Device Enhances Detection of Viruses

Vasily Kolchenko, associate professor of biological sciences at New York City College of Technology (City Tech), is a key player on a research team that recently made a breakthrough with enormous potential significance for the treatment of serious diseases.

15 Dec 2012

Bio-Inspired Aerodynamic Designs for Nano-Scale Vehicles

Ever since the Wright brothers, engineers have been working to develop bigger and better flying machines that maximize lift while minimizing drag.

15 Dec 2012

New Inductor Design with Self-Rolled-Up Silicon Nitrate Nanomembrane Tubes

On the road to smaller, high-performance electronics, University of Illinois researchers have smoothed one speed bump by shrinking a key, yet notoriously large element of integrated circuits.

14 Dec 2012

NVIDIA Secures DARPA Contract to Explore Embedded Processor Technologies

NVIDIA has been awarded a contract worth up to $20 million from the Defense Advanced Research Projects Agency (DARPA) to research embedded processor technologies that could lead to dramatic improvements in the ability of autonomous vehicles to collect and process data from on-board sensors.

13 Dec 2012

Altera Announces First Shipments of its 28nm SoC Devices

Altera Corporation today announced the first shipments of its 28 nm SoC devices, which combine a dual-core ARM® Cortex™-A9 processor system with FPGA logic on a single device.

13 Dec 2012

Nano Composites Developer, 3D Systems Wins PA RAMP Award

3D Systems announced today that its Paramount team was selected by Pennsylvania as one of the state's Research for Advanced Manufacturing in Pennsylvania, RAMP, awardees.

13 Dec 2012

Micron Ships 45nm 1Gb PCM-Based Multichip Package Solution for Mobile Devices

Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, today announced the addition of a new product to its Phase Change Memory (PCM) portfolio. With high-volume shipments of its 45-nanometer (nm), 1-gigabit (Gb) PCM-based multichip package (MCP) solution for mobile devices well underway, the company is now sampling a 512-megabit (Mb) PCM plus 512Mb LPDDR2 MCP that offers greater flexibility in terms of application requirements.

From Micron Technology, Inc. 12 Dec 2012

Researchers Develop Fully Stretchable Supercapacitor Composed of Carbon Nanotube Macrofilms

Electronic devices become smaller, lighter, faster and more powerful with each passing year. Currently, however, electronics such as cell phones, tablets, laptops, etc., are rigid. But what if they could be made bendable or stretchy?

12 Dec 2012

Intel Introduces Low-Power, 64-Bit Server-Class System-on-Chip for High-Density Microservers

Intel Corporation introduced the Intel® Atom™ processor S1200 product family today, delivering the world’s first low-power, 64-bit server-class system-on-chip (SoC) for high-density microservers, as well as a new class of energy-efficient storage and networking systems. The energy-sipping, industrial-strength microprocessor features essential capabilities to achieve server-class reliability, manageability and cost effectiveness.

12 Dec 2012