Nanoelectronics News

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Nanoscale Rectennas Convert Waste Thermal Energy to Electricity

In three studies published in the current issue of Technology and Innovation – Proceedings of the National Academy of Inventors®, innovators unveil creative technologies that could change our sources of energy, change our use of energy, and change our lives.

20 Nov 2012

Omnetics Nano-Circular Connectors for High Reliability Applications

As design miniaturization evolves, mobile instruments, military, surveillance, and medical devices are being asked to go smaller and retain very high reliability. Miniature circuits and instruments are often highly portable and must fit into extremely tight spaces that require quick and easy cable connections in very rugged environments.

From Omnetics Connector Corporation 17 Nov 2012

Researchers Create Catheter for Cardiac Ablation Surgery Using Stretchable Electronics

Researchers at the McCormick School of Engineering are part of a team that has used stretchable electronics to create a multipurpose medical catheter that can both monitor heart functions and perform corrections on heart tissue during surgery.

17 Nov 2012

EV Group Wafer Bonding System Installed at Texas State University

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has installed an EVG501 wafer bonding system at Texas State University.

16 Nov 2012

Self-Assembling Polymer-Based Technique Shows Promise to Increase Computer Memory

The storage capacity of hard disk drives could increase by a factor of five thanks to processes developed by chemists and engineers at The University of Texas at Austin.

15 Nov 2012

Nanotube Cloning Process Paves Way to Use Carbon in Future Electronics

The heart of the computer industry is known as "Silicon Valley" for a reason. Integrated circuit computer chips have been made from silicon since computing's infancy in the 1960s. Now, thanks to a team of USC researchers, carbon nanotubes may emerge as a contender to silicon's throne.

15 Nov 2012

BDA AFS AMS Delivers Fast Mixed-Signal Verification with Nanometer SPICE Accuracy

Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced the availability of Analog FastSPICE™ AMS (AFS AMS) which delivers the industry’s simplest, fastest, most-accurate verification of today’s complex nanometer-scale mixed-signal circuits. AFS AMS combines the award winning, foundry certified Analog FastSPICE circuit simulator with any leading Verilog® hardware description language (HDL) simulator to provide full Verilog-AMS language support.

14 Nov 2012

X-FAB’s First-of-its-Kind SOI Foundry Technology Offers 200V MOS Capability at 180 nm

X-FAB Silicon Foundries today announced its XT018, the world’s first trench dielectric isolated SOI foundry technology offering for 200V MOS capability at 180nm. Using the full dielectric isolation of this modular process allows blocks at different voltage levels to be integrated on a single chip instead of placed on different chips. It significantly reduces the number of required additional components on printed circuit boards, eliminates latch-up and provides built-in robustness against electromagnetic interference.

9 Nov 2012

NANIUM Adds Capability to Manufacture Fan-In Wafer-Level Packaging Products

NANIUM, a leading provider of semiconductor packaging, test and engineering services, today announced that it has extended its offering to include fan-in WLP volume production on 300mm wafers.

8 Nov 2012

Sharp Current Reduction When Dissimilar Metal Wires Meet Poses Challenge to Nanoelectronics

To build the computer chips of the future, designers will need to understand how an electrical charge behaves when it is confined to metal wires only a few atom-widths in diameter.

7 Nov 2012

Nanoelectronics News

Nanoscale Rectennas Convert Waste Thermal Energy to Electricity

Omnetics Nano-Circular Connectors for High Reliability Applications

Researchers Create Catheter for Cardiac Ablation Surgery Using Stretchable Electronics

EV Group Wafer Bonding System Installed at Texas State University

Self-Assembling Polymer-Based Technique Shows Promise to Increase Computer Memory

Nanotube Cloning Process Paves Way to Use Carbon in Future Electronics

BDA AFS AMS Delivers Fast Mixed-Signal Verification with Nanometer SPICE Accuracy

X-FAB’s First-of-its-Kind SOI Foundry Technology Offers 200V MOS Capability at 180 nm

NANIUM Adds Capability to Manufacture Fan-In Wafer-Level Packaging Products

Sharp Current Reduction When Dissimilar Metal Wires Meet Poses Challenge to Nanoelectronics

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Enhancing Material Properties through Nanotube Encapsulation

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Brain-Inspired Nano-Tech Promises New Era for Electronics

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

Sponsored Content

Characterization of Active Pharmaceutical Ingredients, Injectables, and Proteins

The Future of Wound Care: Why Nanofibers are Key to Accelerated Healing

The Evolution of Lipid Nanoparticles

How Emulsion Electrospinning is Transforming Materials