Nanoelectronics News

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NIST Study Proves Thermal Stability of Nanometer-Thick Films for Organic Electronics

A research team from the National Institute of Standards and Technology (NIST) has helped an international research team to verify the stability of an ultrathin membrane using near-edge X-ray absorption fine-structure spectroscopy (NEXAFS).

From National Institute of Standards and Tech (NIST) 19 Apr 2012

Report Predicts Printed Electronics Market Will Reach $45 Billion in 2022

Reportlinker.com has announced the addition of a new report titled ‘Inorganic and Composite Printed Electronics 2012-2022’ from IDTechEx to its offering.

19 Apr 2012

Soitec Announces FD-2D and FD-3D Wafer Roadmap for Planar and FinFET Transistors

Soitec, a provider of semiconductor materials for the energy and electronics markets, has outlined its fully depleted (FD) product roadmap consisting of two products intended for advanced planar and three-dimensional (FinFET) transistors.

18 Apr 2012

ARM Releases New POP Configurations for TSMC 28 nm and 40 nm Process Technologies

ARM has expanded its portfolio of ARM Processor Optimization Pack (POP) solutions targeting several ARM Cortex processors for TSMC’s 28 nm and 40 nm process technologies. The company will release nine POP configurations for Cortex-A15, Cortex-A9, Cortex-A7, and Cortex-A5 processor cores.

18 Apr 2012

Market Research Report on Global Printed Electronics

Electronics.ca Publications has released a new market research report titled "Printed Electronics: The Global Market". According to the latest report, in 2011, the worldwide market for printed electronics was worth about $3.5 billion and this value is anticipated to rise to $12.6 billion in 2016, at a compound annual growth rate of 29.4% in the next five years.

16 Apr 2012

Thin Film Electronics to Develop Prototypes Using Printed Memory

Thin Film Electronics ASA, a Norwegian technology company, has secured a contract to make sample products for identifying parts included in customized manufactured hardware. These prototypes will use Thinfilm Memory, a non-volatile, rewriteable ferroelectric memory, to record configuration of parts in a sample system. The company will deliver the prototypes in the second quarter of 2012.

16 Apr 2012

SMIC Unveils 40-nm Reference Flow for Low-Power Chips

An advanced-node, low-power integrated circuit (IC) design reference flow has been unveiled by Semiconductor Manufacturing International (SMIC) using its 40-nm production process and Cadence Design Systems’ Cadence Encounter digital technology.

From Semiconductor Manufacturing International Corporation (SMIC) 16 Apr 2012

Researcher Receives Grant to Study Reliability of Future Nanoelectronics

Present computer chips demonstrate astounding transistor arrays of over 2.5 billion. However, this number can be increased further with the help of nanotechnologies, which may enable the fabrication of nanotransistors from different materials, including carbon nanotubes, silicon and even larger molecules.

12 Apr 2012

Novocell Semiconductor Tapes Out NVM IP Using IBM 45 nm SOI Process

Novocell Semiconductor, a company dealing with non-volatile memory intellectual property (IP) for the semiconductor industry, declared that its NovoBlox range of non-volatile memory (NVM) at IBM 45 nm SOI process has been successfully taped out for a confidential customer.

6 Apr 2012