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EV Group’s Wafer Cleaning System Deployed at Tokyo Institute of Technology

EV Group’s Wafer Cleaning System Deployed at Tokyo Institute of Technology

First Tape Out of Dual-Core ARM Cortex A9 MPCore Test Chip Using SMIC’s 40 nm Technology

First Tape Out of Dual-Core ARM Cortex A9 MPCore Test Chip Using SMIC’s 40 nm Technology

ARM Offers New Physical IP Solution for GLOBALFOUNDRIES’ 28-nm-SLP HKMG Process

ARM Offers New Physical IP Solution for GLOBALFOUNDRIES’ 28-nm-SLP HKMG Process

Microscopic Single Atom Transistors for Futuristic Quantum Computers

Microscopic Single Atom Transistors for Futuristic Quantum Computers

Fresco Microchip Selects Berkeley’s Analog FastSPICE Platform for Simply RF Silicon TV Tuners

Fresco Microchip Selects Berkeley’s Analog FastSPICE Platform for Simply RF Silicon TV Tuners

Konica Minolta Unveils Inkjet Printhead for Printed Electronics Applications

Konica Minolta Unveils Inkjet Printhead for Printed Electronics Applications

Brion Technologies Announces New Product for 2x nm Chip Designs

Brion Technologies Announces New Product for 2x nm Chip Designs

New Spin-On Hardmask Technology Using Nanocrystals to Impact Semiconductor Industry

New Nanotechnology-Based Platform for Development of Molecule-Based Electronics

New Nanotechnology-Based Platform for Development of Molecule-Based Electronics

Thin Film, PARC Receive FlexTech Alliance Award for Printed Non-Volatile Memory Device

Thin Film, PARC Receive FlexTech Alliance Award for Printed Non-Volatile Memory Device

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