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Intel, Micron Announce Launch of 20 nm, 128 GB NAND Device

Micron Technology and Intel have set a new standard in NAND flash technology with the introduction of a first-of-its-kind 20 nm, 128 Gb multilevel-cell (MLC) device developed by their joint-development company, IM Flash Technologies.

From Micron Technology, Inc. 9 Dec 2011

Aehr Test Systems Announces Supply of 100th Full-Wafer Contactor

Aehr Test Systems, a provider of semiconductor burn-in and test equipment, has supplied its 100th full-wafer contactor for application in its Fox line of equipment used in wafer level burn-in and wafer sort test applications.

9 Dec 2011

IDTechEx Presents Product Development Award in Printed Electronics to Vorbeck Materials and MeadWestvaco

IDTechEx has presented the Product Development Award in Printed Electronics to MeadWestvaco, a pioneer in packaging, and Vorbeck Materials, a provider of products based on graphene, for MeadWestvaco’s novel anti-theft packaging solution called Natralock with Siren Technology.

From Vorbeck Materials 8 Dec 2011

Launch of Three-Dimensional 22-nm Gate Length Silicon Transistors in 2012

New three-dimensional transistors made from tiny indium-gallium-arsenide nanowires can help engineers design lighter laptops and more efficient, compact and faster integrated circuits.

8 Dec 2011

Applied Materials Unveils Fully Automatic Defect Inspection SEM for Rapid Chip Production

Applied Materials has established its presence in defect inspection scanning electron microscope (SEM) technology with the introduction of the first-of-its-kind tool called the Applied SEMVision G5 system that allows chip manufacturers to image and study 20 nm yield-limiting imperfections with no manual interference.

From Applied Materials Inc. 8 Dec 2011

Samsung’s Wafer Production Facility in Austin Reaches Targeted Capacity in Record Time

Samsung Austin Semiconductor has declared that it has completed construction and has ramped up to mass production of S2, its 300 mm automated fab in Austin, Texas, in record time.

8 Dec 2011

Gigaphoton Supplies 1,000th Excimer Laser for Semiconductor Photolithography

Gigaphoton, a provider of lithography light sources, has announced the delivery of its 1,000th excimer laser for photolithography applications in semiconductor fabrication.

7 Dec 2011

EV Group Introduces New Equipment to Extend the Functionality of Volume Manufacturing Products

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has introduced a new equipment platform, dubbed the XT Frame, that ...

From EV Group 5 Dec 2011

SUSS MicroTec Launch XBS300 Temporary Bonder

SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, launched the XBS300 Temporary Bonder, SUSS MicroTec's latest generation of high volume manufacturing tem...

From SUSS MicroTec AG 5 Dec 2011

International Rectifier Buys Several Physical Vapor Deposition Systems from NEXX Systems

NEXX Systems, a processing equipment provider for sophisticated wafer-level packaging applications, has declared that International Rectifier, a provider of power management solutions, has bought several Apollo physical vapor deposition (PVD) systems for its fab facility located in Newport, Wales.

5 Dec 2011

Nanoelectronics News

Intel, Micron Announce Launch of 20 nm, 128 GB NAND Device

Aehr Test Systems Announces Supply of 100th Full-Wafer Contactor

IDTechEx Presents Product Development Award in Printed Electronics to Vorbeck Materials and MeadWestvaco

Launch of Three-Dimensional 22-nm Gate Length Silicon Transistors in 2012

Applied Materials Unveils Fully Automatic Defect Inspection SEM for Rapid Chip Production

Samsung’s Wafer Production Facility in Austin Reaches Targeted Capacity in Record Time

Gigaphoton Supplies 1,000th Excimer Laser for Semiconductor Photolithography

EV Group Introduces New Equipment to Extend the Functionality of Volume Manufacturing Products

SUSS MicroTec Launch XBS300 Temporary Bonder

International Rectifier Buys Several Physical Vapor Deposition Systems from NEXX Systems

Combining Nanofluids and Turbulators for Sustainable Energy

Enhancing Material Properties through Nanotube Encapsulation

Brain-Inspired Nano-Tech Promises New Era for Electronics

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Sustainable ZnO Nanoparticles for Methylene Blue Cleanup

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

Conversations on AFM: Applications of BioAFM in Life Science

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