Nanoelectronics News

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Conductive 1D Vortex-Cores

Adaptive 1D structures in condensed matter systems offer a powerful paradigm for nanoscale device engineering due to the combination of unique physical properties and capability for manipulation by external magnetic, electric, or strain fields without the disruption of the host lattice.

10 Nov 2011

Arizona State University Inks Partnership for Flexible Electronics with City University of Hong Kong

Arizona State University (ASU) and City University of Hong Kong (CityU) have entered into a partnership for the advancement of flexible electronics systems.

From Arizona State University 9 Nov 2011

Mentor Graphics Successfully Tapes Out 20 nm Test Chip

Mentor Graphics, in partnership with STMicroelectronics has successfully taped out a 20 nm test chip, representing a key landmark in the advancement of a full Mentor design-to-silicon solution for future-generation production technology.

8 Nov 2011

ICsense Chooses Berkeley Design’s Nanometre Circuit Verification AFS Platform

European analogue design company ICsense has chose the Analogue Fast Spice (AFS) platform from Berkeley Design Automation, specialising in nanometre circuit verification, for block level characterisation, verification of the full circuit and noise analysis of its mixed signal, high performance and high voltage designs.

4 Nov 2011

Comprehensive Report on Semi-Insulating Epitaxial Substrate Market

The usage of gallium arsenide (GaAs) device has been increased in network infrastructure and mobile phone applications, which in turn increases the usage of GaAs epitaxial wafers, which are the base materials for these devices.

3 Nov 2011

INESC TEC Develops Microelectronic Device to Prevent Bedsores

Tomorrow Options, a company from INESC TEC has developed a device for the prevention of bedsores in patients who are bed ridden. The device called MovinSense is a microelectronic device which detects the movements of the patients and alerts nursing staff so that they can change the position of the patient.

1 Nov 2011

ACM Research Shanghai’s Ultra iSFP Offers Damage-Free 45 to 65 nm Copper Interconnect Stress Free Polishing

ACM Research Shanghai has unveiled the integrated Ultra iSFP, its latest semiconductor production tool that delivers zero-damage 45 to 65 nm copper interlink stress free polishing (SFP).

29 Oct 2011

ACM Research Shanghai Delivers Ultra C Single-Wafer Megasonic Cleaning Tool to Korean Memory Manufacturer

A Korean memory manufacturer has purchased ACM Research Shanghai’s Ultra C 12-inch, single-wafer megasonic cleaning device that uses its space-alternated phase shift (SAPS) technology.

29 Oct 2011

Samsung and Cadence Commence Production of HD Digital Camera System-on-Chip

Samsung Electronics and Cadence Design Systems have commenced the first phase of production of Ambarella’s 32 nm HD digital camera system-on-chip (SoC).

From Samsung Electronics 28 Oct 2011

EV Group Launch ZoneBOND Temporary Wafer Bonding and Debonding System

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has launched a suite of groundbreaking temporary bonding and debonding (TB/DB) equipment modules that support ZoneBOND(TM) technology.

From EV Group 26 Oct 2011