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Oxford Instruments Plasma Technology Announce Dates for 2011 Seminars

Oxford Instruments Plasma Technology Announce Dates for 2011 Seminars

Nanometrics to Provide UniFire Metrology System for Advanced 3D Wafer-Scale Packaging

Nanometrics to Provide UniFire Metrology System for Advanced 3D Wafer-Scale Packaging

New Electron-Beam Writer for Low, Mid Volume Production of Complex Nano Structures

New Electron-Beam Writer for Low, Mid Volume Production of Complex Nano Structures

ISSYS Introduces New MEMS-Based Safe Density Meter

ISSYS Introduces New MEMS-Based Safe Density Meter

SME to Host MicroManufacturing and NanoManufacturing Conference

SME to Host MicroManufacturing and NanoManufacturing Conference

Newport Media Announces Customer Sampling of 65 nm Digital Television ICs

Newport Media Announces Customer Sampling of 65 nm Digital Television ICs

Mentor Offers Advanced Synthesis Support for Achronix's 22nm Speedster22i Devices

Mentor Offers Advanced Synthesis Support for Achronix's 22nm Speedster22i Devices

Dow Electronic Materials’ Japanese Joint Venture Recognized for Excellent Product Development in Polishing Pad Technology

Newest Mobile Data Modem Chipsets from Qualcomm to Support LTE Data Rates

Newest Mobile Data Modem Chipsets from Qualcomm to Support LTE Data Rates

Advanced Flip Chip Packaging Technology from STATS ChipPAC

Advanced Flip Chip Packaging Technology from STATS ChipPAC

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