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InvenSense Exhibits Breakthrough in MEMS Motion Sensing Technology

InvenSense, Inc., the leading solution provider of MotionProcessor™ technology for consumer electronics, is showcasing the MPU-6000™, the world’s first and only 6-axis integrated MotionProcessor (gyroscope + accelerometer), with built-in Digital MotionProcessing™ (DMP) hardware accelerator to perform 10-axis sensor fusion.

27 Jan 2011

Eulitha and Dai Nippon Printing Announces Successful Patterning of 4” Wafers

Today, Eulitha AG of Switzerland and Dai Nippon Printing Co., Ltd. (DNP) of Japan announced the successful patterning of 4” wafers with Eulitha’s proprietary PHABLE technology. Photonic crystal patterns with 600 nm period and hexagonal symmetry was created uniformly over 4” wafers.

27 Jan 2011

Applied Seals North America Leads Task Force to Develop Semiconductor-Grade Sealing Standards

To help the global semiconductor industry prepare for the 22 nm technology node and the use of 450 mm wafers, sealing products supplier Applied Seals North America, Inc. is leading a new SEMI Standards task force to develop the first substantial standards for perfluoroelastomer (FFKM) o-rings and sealing elements.

27 Jan 2011

STMicroelectronics Holds Top Position in MEMS Consumer Market

STMicroelectronics confirms its top position in MEMS (Micro-Electro-Mechanical Systems) devices for consumer and portable applications, according to market analyst iSuppli.

From STMicroelectronics 25 Jan 2011

Rambus Buys Lighting and Display Patents from Imagine Designs

Rambus Inc. one of the world's premier technology licensing companies, today announced it has acquired the lighting and display portfolio of patents and technology from privately held Imagine Designs Inc.

25 Jan 2011

Researchers Study Single-Molecule Interactions Using Nanoscale Transistors

An interdisciplinary team from Columbia University that includes electrical engineers from Columbia's Engineering School, together with researchers from the University's departments of Physics and Chemistry, has ...

25 Jan 2011

Advance in Nanostructured Materials for Electronic Packaging Applications

Semiconductor Research Corporation (SRC), the world's leading university-research consortium for semiconductors and related technologies, and researchers from Stanford University have developed a novel combination of elements that yields a unique nanostructure material for packaging.

25 Jan 2011

New Report on ADXL278 MEMS Accelerometer Reverse Costing

Research and Markets has announced the addition of the "Analog Devices ADXL278 MEMS accelerometer Reverse Costing" report to their offering. Physical Analysis of the Device - Step by Step Reconstruction of the Proces...

25 Jan 2011

Cadence Develops New 32, 28-nm Design-for-Manufacturing Flow Along with STARC

Cadence Design Systems, Inc. a leader in global electronic design innovation, today announced that it has teamed with the Semiconductor Technology Academic Research Center (STARC), a Japanese design consortium, and created an innovative new Cadence®-based 32/28-nanometer design-for-manufacturing (DFM) flow.

From Cadence Design Systems 25 Jan 2011

Altera Announces Portfolio of 28 nm Devices

Delivering the industry's most comprehensive set of device options tailored to customers' diverse design requirements, Altera Corporation today announced its portfolio of 28-nm devices.

25 Jan 2011