Nanoelectronics News

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Researchers Use Nanotechnology to Improve Thermoelectric Performance of Bulk Semiconductor

Researchers from Boston College, MIT, Clemson and Virginia have used nanotechnology to achieve a 60-90 percent increase in the thermoelectric figure of merit of p-type half-Heusler, a common bulk semiconductor compound, ...

28 Jan 2011

Piezoelectricity Increases in Nanowires with Decrease in Diameter

Gallium nitride (GaN) and zinc oxide (ZnO) are among the most technologically relevant semiconducting materials.

28 Jan 2011

Ecliptek Adds Six New MEMS Clocks to its Product Line

Once again responding to engineers requests, Ecliptek Corporation has strengthened its line of clock oscillator solutions with six new product series covering an extensive breadth of technology.

27 Jan 2011

SiTime Offers New MEMS-Based Clock Generator for High-Performance Networking Applications

SiTime Corporation, the leader in MEMS-based silicon timing solutions, expanded its Programmable Clock Generator family with the SiT9105, a 3-PLL, 5 output device that is ideal for high-performance networking applications.

27 Jan 2011

InvenSense Exhibits Breakthrough in MEMS Motion Sensing Technology

InvenSense, Inc., the leading solution provider of MotionProcessor™ technology for consumer electronics, is showcasing the MPU-6000™, the world’s first and only 6-axis integrated MotionProcessor (gyroscope + accelerometer), with built-in Digital MotionProcessing™ (DMP) hardware accelerator to perform 10-axis sensor fusion.

27 Jan 2011

Eulitha and Dai Nippon Printing Announces Successful Patterning of 4” Wafers

Today, Eulitha AG of Switzerland and Dai Nippon Printing Co., Ltd. (DNP) of Japan announced the successful patterning of 4” wafers with Eulitha’s proprietary PHABLE technology. Photonic crystal patterns with 600 nm period and hexagonal symmetry was created uniformly over 4” wafers.

27 Jan 2011

Applied Seals North America Leads Task Force to Develop Semiconductor-Grade Sealing Standards

To help the global semiconductor industry prepare for the 22 nm technology node and the use of 450 mm wafers, sealing products supplier Applied Seals North America, Inc. is leading a new SEMI Standards task force to develop the first substantial standards for perfluoroelastomer (FFKM) o-rings and sealing elements.

27 Jan 2011