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Rudolph Technologies Announces Collaboration to Develop Integrated Wafer Inspection Systems

Rudolph Technologies, Inc. a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities announced today that it will collaborate with a leading process tool supplier and an IC device manufacturer in the development of 3D advanced semiconductor packaging applications.

From Onto Innovation 19 Jan 2011

St. Gabriel’s Catholic School Honored for Nanotechnology-Based Bio-Medical Research Project

St. Gabriel’s Catholic School was awarded the Champion Award at the FIRST LEGO League (FLL) robotics state competition this weekend clearing the way for a trip to LEGOLAND® to compete for the national title in ...

19 Jan 2011

Samsung’s New 4 Gb, 40 nm-Class DDR3 Memory to be Used in HP ProLiant Servers

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that its new 4 gigabit (Gb)-based 40 nanometer (nm) class low power DDR3 memory will be used in HP ProLiant G7 servers.

From Samsung Electronics 18 Jan 2011

STATS ChipPAC Announces New 300 mm Wafer Level Packaging Capability in Taiwan

STATS ChipPAC Ltd., a leading semiconductor test and advanced packaging service provider, today announced the expansion of its wafer level package (WLP) offering with new 300mm manufacturing capabilities in Taiwan.

18 Jan 2011

ARM, IBM to Develop Design Platforms Down to 14 nm Node for Advanced Consumer Electronics

ARM® [(LSE: ARM); (Nasdaq: ARMH)] and IBM (NYSE: IBM) today announced an agreement between the two companies to extend their collaboration on advanced semiconductor technologies to enable the rapid development of nex...

18 Jan 2011

Synopsys Delivers 28 nm Design Solution Based on Lynx Design System

Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today announced it is delivering a low power, high-performance system-on-chip (SoC) design solution optimized for the Common Platform alliance (CPA) 28-nanometer(nm) high-k metal gate (HKMG) technology.

From Synopsys, Inc. 18 Jan 2011

Cadence Unveils New 32, 28-Nanometer Silicon Realization Reference Flow

Cadence Design Systems, Inc., a leader in global electronic design innovation, today introduced a qualified 32/28-nanometer reference flow targeting Common Platform™ technology.

From Cadence Design Systems 18 Jan 2011

NetLogic Microsystems Develops Next-Generation Silicon in Advanced 28 nm Process

NetLogic Microsystems, Inc., a worldwide leader in high-performance intelligent semiconductor solutions for next-generation Internet networks, today announced that it has developed and taped out its next-generation silicon in the advanced 28nm process at Taiwan Semiconductor Manufacturing Company (TSMC).

18 Jan 2011

OMRON to Launch New MEMS Flow Sensor for Use in Fuel Cell Systems

OMRON Corporation today announced plans to release the D6F-70, a 70L/min MEMS flow sensor optimized for measuring the gas flow rate of fuel cell systems.

18 Jan 2011

OptiXtal Unveils World's Smallest Supercapacitor

As technology fits into smaller and smaller footprints, the need for supercapacitors that can offer high functionality and long term reliability in extremely tight spaces has become critical. Now OptiXtal, a Delaware Corporation, introduces the world's smallest supercapacitor...the SuperXcap(tm) Mini.

18 Jan 2011