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Analysis on Reverse Costing and Engineering Process of SiT8002 MEMS Oscillator

Research and Markets has announced the addition of the "SiTime SiT8002 MEMS oscillator Reverse Costing" report to their offering. Reverse costing & engineering process analysis of the famous MEMS Oscillator SiT80...

18 Jan 2011

CEA-Leti to Ramp Up Europe's First 300mm Lines Dedicated to 3D Integration Applications

CEA-Leti, a recognized leader in 3D integration R&D, will significantly expand its technology offering this month when it ramps up one of Europe's first 300mm lines dedicated to 3D-integration applications. B...

From CEA-Leti 17 Jan 2011

Nanometer Thick Conductive Layer on Transparent Insulating Material Shows Promise for Future Microelectronic Applications

Researchers at CNRS and Université Paris-Sud 11[1] have succeeded in creating a conductive layer on the surface of strontium titanate (SrTiO3), a transparent insulating material considered to be very promising for t...

17 Jan 2011

Fraunhofer IMS Orders Tegal 200 SE DRIE System for Advanced MEMS Development

Tegal Corporation, an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices, today announced it has received an order from the Fraunhofer Institute for Microelectronic Circuits and Systems in Duisburg, Germany for a Tegal 200 SE™ DRIE system equipped with the new Tegal ProNova2™ reactor.

From Collabrx, Inc. 14 Jan 2011

Analysis on L3G4200D 3-Axis MEMS Gyroscope Reverse Costing

Research and Markets has announced the addition of the "ST L3G4200D MEMS gyro 3-axes Reverse Costing" report to their offering. Physical Analysis of the Device Step by Step Reconstruction of the Process Flo...

14 Jan 2011

Spaser Can Fuel Development of Future Nano-Sized Devices

Lasers have revolutionized the communications and medical industries. They focus light to zap tumors and send digital TV signals and telephone communications around the world. But the physical length of an ordinary l...

13 Jan 2011

New 28 nm Signoff-Ready Flows from GLOBALFOUNDRIES for Chip Designers

GLOBALFOUNDRIES today introduced the industry’s first 28nm silicon-validated signoff-ready digital design flows to help chip designers deliver the next generation of power-sensitive mobile and consumer electronic devices.

From GlobalFoundries 13 Jan 2011

Synopsys' DesignWare ARC 750D Processor Core is Ideal to Drive Android-Based Applications

Synopsys, Inc. a world leader in software and IP for semiconductor design, verification and manufacturing, today announced Android operating system (v2.2 FroYo) support for the DesignWare™ ARC™ 750D processor core.

From Synopsys, Inc. 13 Jan 2011

Scientists Continue to Work on New Molecular Imaging Technologies

The work carried out by these scientists has ranged from the initial design of an electronic architecture for gamma ray detectors to industry transfer of a complete scanner, after having adequately validated a prototype through experimental studies at the Gregorio Marañón Hospital.

13 Jan 2011

Researchers Create New Silicon Nanocoils

Researchers at North Carolina State University have created the first coils of silicon nanowire on a substrate that can be stretched to more than double their original length, moving us closer to incorporating stretchable electronic devices into clothing, implantable health-monitoring devices, and a host of other applications.

From North Carolina State University 13 Jan 2011